Medical tablet, and manufacturing method and manufacturing apparatus for medical tablet

ABSTRACT

An object is to provide a tablet manufacturing apparatus capable of supplying an IC chip to a desired position of pharmaceutical powder with a high accuracy and suppressing a positional displacement. The IC chip is supported by a positioning guide with a chip main body in a downward manner, and is held in a state of being positioned above pharmaceutical powder filled in a die hole before compression. The IC chip is supplied by a pusher.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.14/652,380, filed Jun. 15, 2015 and titled “Medical Tablet, andManufacturing Method and Manufacturing Apparatus for Medical Tablet,”which is a US National Stage Entry of PCT Application No.PCT/JP2013/084015, filed Dec. 19, 2013, which claims priority toJapanese Patent Application No. 2013-177383, filed Aug. 28, 2013,Japanese Patent Application No. 2012-277460, filed Dec. 19, 2012,Japanese Patent Application No. 2012-277459, filed Dec. 19, 2012 andJapanese Patent Application No. 2012-277458, filed Dec. 19, 2012.

TECHNICAL FIELD

The present invention relates to a medical tablet, and a manufacturingmethod and a manufacturing apparatus for a medical tablet. Morespecifically, it relates to a medical tablet containing an IC chip, anda manufacturing method and manufacturing apparatus for the medicaltablet.

BACKGROUND ART

There is a core-containing tablet as a kind of a tablet for use in amedicine and the like. This core-containing tablet includes a nucleatedtablet and a covering portion in a periphery thereof. Generally, anucleated tablet and a covering portion are composed of different kindsof medicines or pharmaceutical compositions each other, and a nucleatedtablet is buried in a tablet center. When a nucleated tablet is notlocated at a center of a tablet, not only a loss or crack may occur in acovering portion, but also expression of an expected efficacy isdisturbed, or an unexpected side reaction may occur. As described above,the positioning of the nucleated tablet may greatly affect a quality ofa core-containing tablet. As a tablet manufacturing apparatus whichmanufactures this kind of core-containing tablet, there is for example arotational core-containing tablet manufacturing machine as disclosed inPTD 1.

This rotational core-containing tablet manufacturing machine has a basicconfiguration to fill pharmaceutical powder into a plurality of dieholes provided at predetermined intervals on a circumference along anouter edge portion of a rotating disk rotating at a high speed, supply anucleated tablet onto pharmaceutical powder, further fill pharmaceuticalpowder onto the nucleated tablet, and thereafter compress and shapethese pharmaceutical powders and nucleated tablet by means of a lowerpestle and an upper pestle.

In the apparatus disclosed in PTD 1, a supplying apparatus whichsupplies a nucleated tablet is devised for the purpose of positioning anucleated tablet at a tablet center. A plurality of plate springs (23)are radially or diagonally radially mounted on a transfer disk (14), anda nucleated tablet insertion pin (27) is attached to the free endthereof and located above a nucleated tablet holding portion (15) oftransfer disk (14). A push-down roller (39) is provided which comes intocontact with a head (29) of nucleated tablet insertion pin (27) andpushes down the same when nucleated tablet holding portion (15) oftransfer disk (14) and die hole (4) of a rotating disk (5) overlap eachother. The nucleated tablet is forced by nucleated tablet insertion pin(27) at a predetermined timing and then dropped and supplied. Asillustrated above, an operation timing of nucleated tablet insertion pin(27) is set to be a timing of overlapping nucleated tablet holdingportion (15) and die hole (4), so that the dropped nucleated tablet isdropped onto a center of pharmaceutical powder already filling die hole(4). It should be noted that the numbers in parenthesis are referencecharacters disclosed in the publication of the patent document.

CITATION LIST Patent Documents

-   PTD 1: Japanese Patent No. 4549504-   PTD 2: Japanese Patent Laying-Open No. 6-115687-   PTD 3: Japanese Patent No. 4591758

SUMMARY OF INVENTION Technical Problem

Now, an IC chip-containing tablet having an IC chip buried in a tabletis considered. The IC chip-containing tablet has a medicine at an outerperipheral wall of the IC chip. Assuming that this IC chip is anucleated tablet, it is supposed that an IC chip is supplied so as to bepositioned at a center of a tablet with use of the above-describedconventional apparatus. In that case, it was indeed difficult to supplyan IC chip with a high accuracy to a center within appropriately filledpowder due to the following reasons.

In other words, for example, as disclosed in paragraph [0023] of PTD 1 “. . . nucleated tablet C is dropped onto pharmaceutical powder firstlayer P1 filled in said die hole 4” or paragraph [0024] “a failure isless likely to occur in a dropping mechanism itself, so that accuracyand reproducibility of the dropping position of nucleated tablet C areimproved,” a nucleated tablet is dropped and supplied to pharmaceuticalpowder. Therefore, when a nucleated tablet is replaced with an IC chip,there is a likelihood that the IC chip is not dropped smoothly and isdropped at a position displaced from a center.

Moreover, for example, when a form of an IC chip to be buried is notconfigured as a single body of a rectangular chip main body but isconfigured such that the chip main body is mounted to a film having apredetermined shape, a resistance applied to a film at the time ofdropping may become greater, and the chip may not fall while maintaininga horizontal state, so that it may be set on a surface of pharmaceuticalpowder in a slanted state. Moreover, in the case of the IC chip of atype having a film in such a manner, even when the IC chip isappropriately dropped to a center of a surface of pharmaceutical powder,the chip may slip on the surface of pharmaceutical powder during thesubsequent movement and therefore is likely to cause a positionaldisplacement.

On the other hand, the present inventor was conceived of supplying an ICchip in a downward manner to pharmaceutical powder. However, since thiskind of IC chip is provided such that it is set in an accommodationportion provided in a carrier tape, in an upward manner with a chip mainbody facing upward, and is accommodated in an accommodation tape inwhich an opening side of the accommodation portion is covered with a toptape, the IC chip is in an upward manner when the top tape is peeled offto open. Therefore, since the IC chip cannot be directly supplied topharmaceutical powder in a downward manner, it is necessary to reverseupside down on the course.

For example, PTDs 2 and 3 disclose the invention of a reversingapparatus for an electronic component. The apparatus disclosed in PTD 2has rotatable suction means arranged to face each other and passes itemsin a state where suction portions thereof face each other. However, theapparatus disclosed in PTD 2 needs a separate transfer mechanism forreversing the item. Therefore, the configuration is complicated.

PTD 3 reverses an item by rotation of a head provided with upper andlower cover members which are slidable in a forward and backwarddirection. However, since the cover member needs to open/close andslide, it is not suitable for a high-speed processing. Further, in thecase of a fine electronic component of, for example, severalmillimeters, holding by suction means cannot be performed firmly.Therefore, since the passing cannot be performed smoothly, an item islikely to be dropped.

Moreover, in the case of a type provided with the above-described film,outside dimensions become greater, so that a difference with respect todimensions of a tablet becomes smaller. Therefore, even a slightdisplacement of a supply position to pharmaceutical powder may cause anIC chip to be forced out of a tablet. Higher accuracy in the supplyposition is required as a problem.

Moreover, the rotational core-containing tablet manufacturing machinedisclosed in PTD 1 employs a configuration in which a tabletting machinemeasuring pharmaceutical powder, placing a desired quantity of thepharmaceutical powder in a die, pressing the pharmaceutical powderplaced in the die from above and below to form a predetermined shape ofthe tablet is integrated with a nucleated tablet supply apparatussupplying a nucleated tablet with respect to pharmaceutical powder, and,above a rotating plate equipped with the die, the nucleated tabletsupply apparatus rotating together with rotation of the rotating plateis arranged. On the other hand, when a nucleated tablet supply apparatusis provided separately from a tabletting machine, a region in which anIC chip can be supplied into the die of the tabletting machine havingpharmaceutical powder placed therein may be limited. Consequently, it isnecessary to supply an IC chip appropriately with use of a narrow space,and there is a likelihood that a space for mounting a inspectionapparatus which performs inspection on whether or not an IC chip islocated at a center of pharmaceutical powder cannot be reserved. In sucha case, there is a problem that it would be necessary to supply the ICchip at a center position with higher accuracy.

Solution to Problem

A manufacturing apparatus for medical tablets manufactures an IC chipmember-containing tablet manufactures by supplying an IC chip memberequipped with an IC on pharmaceutical powder willed in a die hole,thereafter filling pharmaceutical powder onto the IC chip member, andcompressing these pharmaceutical powder and the IC chip member fromabove and below. The IC chip member has a base plane, and a convexportion protruding more on one side than the other side with respect tothe base plane, and the manufacturing apparatus for medical tabletscomprises a supply portion which holds the IC chip member convex portionin a downward manner with the convex portion facing downward, andsupplies the IC chip member on the pharmaceutical powder.

Preferably, the IC chip member is set in an accommodation portionprovided in a carrier tape, in an upward manner with the convex portionfacing upward, and is accommodated in an accommodation tape in which anopening side of the accommodation portion is covered with a top tape,and the IC chip member in said upward manner is taken out of saidaccommodation portion, the taken-out IC chip member is reversed upsidedown and changed to said downward manner, and thereafter the supplyportion supplies the IC chip member.

A manufacturing apparatus for medical tablets manufactures an IC chipmember-containing tablet by supplying an IC chip member equipped with anIC on pharmaceutical powder filled in a die hole, thereafter fillingpharmaceutical powder onto the IC chip member, and compressing thesepharmaceutical powder and the IC chip member from above and below. Themanufacturing apparatus for medical tablets comprises a first suctionmember which suctions and holds the IC chip member; a second suctionmember which suctions the IC chip member held by said first suctionmember, from a side opposite to said first suction member; and guidemember provided with a through-hole into which the IC chip member is tobe inserted. A suction portion of said first suction member is insertedfrom one side of said through-hole, and a suction portion of said secondsuction member is inserted from the other side of said through-hole, andthe IC chip member is passed from said first suction member to saidsecond suction member within said through-hole.

Preferably, inner shape dimensions of said through-hole are formed to bewide at end portions on said one side and the other side, and to benarrow at an intermediate position, and the IC chip member is passed atsaid intermediate position.

Preferably, the IC chip member is accommodated in a carrier tape, andsaid first suction member suctions and holds the IC chip member withinthe carrier tape, rotates by a set angle, and inserts the IC chip memberinto said through-hole in said guide member.

Preferably, said guide member includes a plurality of moving guidemembers, and a drive mechanism which causes the plurality of movingguide members to come close to or separate from each other, and theplurality of moving guide members come close to each other to form saidthrough-hole.

A manufacturing apparatus for medical tablets, which manufactures an ICchip member-containing tablet by supplying an IC chip member onpharmaceutical powder filled in a die hole, further fillingpharmaceutical powder onto the IC chip member, and compressing thesepharmaceutical powder and the IC chip member from above and below. Themanufacturing apparatus for medical tablets comprises a positioningguide which has a through-hole penetrating up and down, and holds the ICchip member within the through-hole; and push-out portion arranged abovethe positioning guide for pushing out said IC chip member downward. Aplurality of protrusions protruding toward a center are provided on aninside of said through-hole, and said IC chip member is held by theprotrusions.

Preferably, said plurality of protrusions are convex threads extendingalong an axial direction of said through-hole. Preferably, said convexthreads are formed to a lower end of said through-hole.

Preferably, said positioning guide is provided to a rotation member, andthe IC chip member is pushed from above into said positioning guidelocated at a receiving position and the IC chip member is held by saidprotrusions, and, in a state where said positioning guide holding the ICchip member rotates and moves together with rotation of said rotationmember and is located above said die hole of a tabletting machine, theheld IC chip member is supplied into said die hole by said push-outportion.

A manufacturing method for medical tablets comprises the steps ofholding an IC chip member, which has a base plane and a convex portionprotruding more on one side than on the other side with respect to thebase plane, in a downward manner with the convex portion facingdownward, and supplying the IC chip member in the downward manner onpharmaceutical powder filled in a die hole, and manufacturing a tabletcontaining said IC chip by filling pharmaceutical powder onto said ICchip member, and compressing these pharmaceutical powder and said ICchip member from above and below.

A manufacturing method for medical tablets comprises the steps of afirst suction member suctioning and holding an IC chip member, insertinga suction portion of said first suction member from one side of athrough-hole, inserting a suction portion of a second suction memberfrom the other side of said through-hole, passing said IC chip memberfrom said suction member to said second suction member within saidthrough-hole to hold said IC chip member, and thereafter supplying saidIC chip member on pharmaceutical powder filled in a die hole, andmanufacturing a tablet containing said IC chip member by fillingpharmaceutical powder onto said IC chip member, and compressing thesepharmaceutical powder and said IC chip member from above and below.

A manufacturing method for medical tablets comprises the steps ofholding an IC chip member with a plurality of protrusions protrudingtoward a center provided on an inside of a through-hole in a positioningguide, supplying said IC chip member held within said through-hole onpharmaceutical powder filled in a die hole, and manufacturing a tabletcontaining said IC chip member by filling pharmaceutical powder ontosaid IC chip member, and compressing these pharmaceutical powders andsaid IC chip member from above and below.

Preferably, the manufacturing method for medical tablets furthercomprises the step of pushing said IC chip member from above into saidpositioning guide located at a receiving position. The step of supplyingsaid IC chip member includes supplying held said IC chip member intosaid die hole by a push-out portion, in a state where said positioningguide holding said IC chip member rotates and moves together withrotation of a rotation member and is located above said die hole of atabletting machine.

A medical tablet including an IC chip member equipped with an IC thereinhas a first surface and a second surface spaced from each other in anup/down direction. An engraved stamp or cleavage line is formed in saidfirst surface. An engraved stamp or cleavage line is not formed or anengraved stamp or cleavage line shallower than that in said firstsurface is formed in said second surface. The IC chip member has a baseplane and a convex portion protruding more on one side than on the otherside with respect to said base plane, and the convex portion is arrangedwithin the medical tablet to face the second face.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a front view representing a favorable one embodiment of atablet manufacturing apparatus according to the present invention.

FIG. 2 is a plan view thereof.

FIG. 3 is a plan view omitting illustration of a robot.

FIG. 4A is a diagram for explaining an IC chip to be supplied.

FIG. 4B is a diagram for explaining an IC chip to be supplied.

FIG. 4C is a diagram for explaining an IC chip to be supplied.

FIG. 5A is a plan view representing an accommodation tape openingportion 13 and an IC chip take-out apparatus 20.

FIG. 5B is a front view representing a tape opening portion 13 and an ICchip take-out apparatus 20.

FIG. 5C is a side view representing a tape opening portion 13 and an ICchip take-out apparatus 20.

FIG. 6 is an enlarged front view representing a tape opening portion 13and an IC chip take-out apparatus 20.

FIG. 7A is a diagram for explaining an effect and explaining taking outan IC chip 4 from an accommodation tape 7.

FIG. 7B is a diagram for explaining an effect and explaining passing ofa reversed IC chip.

FIG. 8A is an enlarged view representing a main part of FIG. 7A.

FIG. 8B is an enlarged view representing a main part of FIG. 7B.

FIG. 9A is a side view representing a conveying apparatus 21.

FIG. 9B is a front view representing a conveying apparatus 21.

FIG. 10A is a diagram for explaining passing of an IC chip from a secondsuction and hold member to a conveying apparatus.

FIG. 10B is a diagram for explaining passing of an IC chip from aconveying apparatus to a third suction nozzle portion.

FIG. 11A is a front view representing a tabletting machine.

FIG. 11B is a front view representing a tabletting machine.

FIG. 12 is an enlarged view representing a main part of an IC chipsupply apparatus 74.

FIG. 13A is a plan view representing a positioning guide 61.

FIG. 13B is a front view representing a positioning guide 61.

FIG. 13C is a bottom view representing a positioning guide 61.

FIG. 14A is a diagram for explaining an operation of an IC chip supplyapparatus 74.

FIG. 14B is a diagram for explaining an operation of an IC chip supplyapparatus 74.

FIG. 14C is a diagram for explaining an operation of an IC chip supplyapparatus 74.

FIG. 14D is a diagram for explaining an operation of an IC chip supplyapparatus 74.

FIG. 15A is an enlarged view representing a main part of FIG. 14A.

FIG. 15B is an enlarged view representing a main part of FIG. 14B.

FIG. 15C is an enlarged view representing a main part of FIG. 14C.

FIG. 15D is an enlarged view representing a main part of FIG. 14D.

FIG. 16A is a diagram for explaining a function of a tabletting machinemain body 76.

FIG. 16B is a diagram for explaining a function of a tabletting machinemain body 76.

FIG. 17A is a diagram for explaining a function of a tabletting machinemain body 76.

FIG. 17B is a diagram for explaining a function of a tabletting machinemain body 76.

FIG. 18A is a diagram for explaining a function of a tabletting machinemain body 76.

FIG. 18B is a diagram for explaining a function of a tabletting machinemain body 76.

FIG. 19A is a diagram for explaining a function of a tabletting machinemain body 76.

FIG. 19B is a diagram for explaining a function of a tabletting machinemain body 76.

FIG. 20A is a diagram for explaining a function of a tabletting machinemain body 76.

FIG. 20B is a diagram for explaining a function of a tabletting machinemain body 76.

FIG. 20C is a diagram for explaining a function of a tabletting machinemain body 76.

FIG. 20D is a perspective view representing a tablet for a medicine inaccordance with an embodiment.

FIG. 21 is a front view representing a favorable one embodiment of atablet manufacturing apparatus according to the present invention.

FIG. 22 is a plan view representing a favorable one embodiment of atablet manufacturing apparatus according to the present invention.

FIG. 23 is a plan view omitting illustration of a robot.

FIG. 24A is a diagram for explaining an IC chip to be supplied.

FIG. 24B is a diagram for explaining an IC chip to be supplied.

FIG. 24C is a diagram for explaining an IC chip to be supplied.

FIG. 25A is a plan view representing an accommodation tape openingportion 1013 and an IC chip take-out apparatus 1020.

FIG. 25B is a front view representing an accommodation tape opening 1013and an IC chip take-out apparatus 1020.

FIG. 25C is a side view representing an accommodation tape opening 1013and an IC chip take-out apparatus 1020.

FIG. 26 is an enlarged front view representing an accommodation tapeopening 1013 and an IC chip take-out apparatus 1020.

FIG. 27A is a diagram for explaining an effect and explaining taking outof an IC chip 1004 from an accommodation tape 1007.

FIG. 27B is a diagram for explaining an effect and explaining passing ofa reversed IC chip.

FIG. 28A is an enlarged view representing a main part of FIG. 27A.

FIG. 28B is an enlarged view representing a main part of FIG. 27B.

FIG. 29A is a side view representing a conveying apparatus 1021.

FIG. 29B is a front view representing a conveying apparatus 1021.

FIG. 30A is a diagram for explaining passing of an IC chip from a secondsuction and hold member to a conveying apparatus.

FIG. 30B is a diagram for explaining passing of an IC chip from aconveying apparatus to a third suction nozzle portion.

FIG. 31A is a plan view representing a tabletting machine.

FIG. 31B is a front view representing a tabletting machine.

FIG. 32 is an enlarged view representing a main part of an IC chipsupply apparatus 1074.

FIG. 33A is a plan view representing a positioning guide 1061.

FIG. 33B is a front view representing a positioning guide 1061.

FIG. 33C is a bottom view representing a positioning guide 1061.

FIG. 34A is a drawing for explaining an operation of an IC chip supplyapparatus 1074.

FIG. 34B is a diagram for explaining an operation of an IC chip supplyapparatus 1074.

FIG. 34C is a diagram for explaining an operation of an IC chip supplyapparatus 1074.

FIG. 34D is a diagram for explaining an operation of an IC chip supplyapparatus 1074.

FIG. 35A is an enlarged view representing a main part of FIG. 34A.

FIG. 35B is an enlarged view representing a main part of FIG. 34B.

FIG. 35C is an enlarged view representing a main part of FIG. 34C.

FIG. 35D is an enlarged view representing a main part of FIG. 34D.

FIG. 36A is a diagram for explaining a function of a tabletting machinemain body 1076.

FIG. 36B is a diagram for explaining a function of a tabletting machinemain body 1076.

FIG. 37A is a diagram for explaining a function of a tabletting machinemain body 1076.

FIG. 37B is a diagram for explaining a function of a tabletting machinemain body 1076.

FIG. 37C is a diagram for explaining a function of a tabletting machinemain body 1076.

FIG. 38A is a diagram for explaining a function of a tabletting machinemain body 1076.

FIG. 38B is a diagram for explaining a function of a tabletting machinemain body 1076.

FIG. 38C is a diagram for explaining a function of a tabletting machinemain body 1076.

FIG. 39A is a diagram for explaining a function of a tabletting machinemain body 1076.

FIG. 39B is a diagram for explaining a function of a tabletting machinemain body 1076.

FIG. 39C is a diagram for explaining a function of a tabletting machinemain body 1076.

FIG. 40A represents a modified example of a guide member and representsa state where moving guide portions are separated apart and opened.

FIG. 40B represents a modified example of a guide member and representsa state where moving guide portions come close to each other and areclosed.

FIG. 41 is a front view representing a favorable one embodiment of atablet manufacturing apparatus according to the present invention.

FIG. 42 is a plan view representing a favorable one embodiment of atablet manufacturing apparatus according to the present invention.

FIG. 43 is a plan view omitting illustration of a robot.

FIG. 44A is a diagram for explaining an IC chip to be supplied.

FIG. 44B is a diagram for explaining an IC chip to be supplied.

FIG. 44C is a diagram for explaining an IC chip to be supplied.

FIG. 45A is a plan view representing an accommodation tape openingportion 2013 and an IC chip take-out apparatus 2020.

FIG. 45B is a front view representing an accommodation tape openingportion 2013 and an IC chip take-out apparatus 2020.

FIG. 45C is a side view representing an accommodation tape openingportion 2013 and an IC chip take-out apparatus 2020.

FIG. 46 is an enlarged front view representing an accommodation tapeopening portion 2013 and an IC chip take-out apparatus 2020.

FIG. 47A is a diagram for explaining an effect and explaining taking outan IC chip 2004 from an accommodation tape 2007.

FIG. 47B is a diagram for explaining an effect and explaining passing ofa reversed IC chip.

FIG. 48A is an enlarged view representing a main part of FIG. 47A.

FIG. 48B is an enlarged view representing a main part of FIG. 47B.

FIG. 49A is a side view representing a conveying apparatus 2021.

FIG. 49B is a front view representing a conveying apparatus 2021.

FIG. 50A is a diagram for explaining passing of an IC chip from a secondsuction and hold member to a conveying apparatus.

FIG. 50B is a diagram for explaining passing of an IC chip from aconveying apparatus to a third suction nozzle portion.

FIG. 51A is a plan view representing a tabletting machine.

FIG. 51B is a front view representing a tabletting machine.

FIG. 52 is an enlarged view representing a main part of an IC chipsupply apparatus 2074.

FIG. 53A is a plan view representing a positioning guide 2061.

FIG. 53B is a front view representing a positioning guide 2061.

FIG. 53C is a bottom view representing a positioning guide 2061.

FIG. 54A is a diagram for explaining an operation of an IC chip supplyapparatus 2074.

FIG. 54B is a diagram for explaining an operation of an IC chip supplyapparatus 2074.

FIG. 54C is a diagram for explaining an operation of an IC chip supplyapparatus 2074.

FIG. 54D is a diagram for explaining an operation of an IC chip supplyapparatus 2074.

FIG. 55A is an enlarged view representing a main part of FIG. 54A.

FIG. 55B is an enlarged view representing a main part of FIG. 54B.

FIG. 55C is an enlarged view representing a main part of FIG. 54C.

FIG. 55D is an enlarged view representing a main part of FIG. 54D.

FIG. 56A is a diagram for explaining a function of a tabletting machinemain body 2076.

FIG. 56B is a diagram for explaining a function of a tabletting machinemain body 2076.

FIG. 56C is a diagram for explaining a function of a tabletting machinemain body 2076.

FIG. 56D is a diagram for explaining a function of a tabletting machinemain body 2076.

FIG. 56E is a diagram for explaining a function of a tabletting machinemain body 2076.

FIG. 56F is a diagram for explaining a function of a tabletting machinemain body 2076.

FIG. 56G is a diagram for explaining a function of a tabletting machinemain body 2076.

FIG. 56H is a diagram for explaining a function of a tabletting machinemain body 2076.

FIG. 56I is a diagram for explaining a function of a tabletting machinemain body 2076.

FIG. 56J is a diagram for explaining a function of a tabletting machinemain body 2076.

FIG. 56K is a diagram for explaining a function of a tabletting machinemain body 2076.

DESCRIPTION OF EMBODIMENTS

FIG. 1 is a front view representing a favorable one embodiment of atablet manufacturing apparatus according to the present invention. FIGS.2 and 3 are plan views thereof. FIGS. 4A to 4C are diagrams forexplaining an IC chip to be supplied in the present embodiment. Drawingssubsequent to FIG. 4A are enlarged views of each portion of theapparatus and diagrams for explaining an effect.

As shown in FIGS. 1 to 3, tablet manufacturing apparatus according tothe present embodiment includes a tabletting machine 2, and a supplyapparatus 3 which conveys and supplies an IC chip to tabletting machine2. An IC chip 4 conveyed and supplied by the present embodiment has aform in which a chip main body 6 is mounted at a center position of acircular base film 5 as shown in FIGS. 4A to 4C. Base film 5, forexample, has a disk-like outer diameter of 3.5 mm, and, for example,includes a function for supporting chip main body 6, an antenna functionfor communicating information with outside, and the like. Chip main body6, for example, has a rectangular outer shape of 1 mm square, and anelectronic circuit is incorporated therein. Chip main body 6 includes,for example, a storage portion for storing information specifying atablet into which IC chip 4 is buried, a function for transmittinginformation stored in the storage portion at a predetermined timing, andthe like.

As shown in FIGS. 4A and 4B, IC chips 4 having the above-describedconfiguration are arranged in one line with predetermined intervals on abelt-like accommodation tape 7. Accommodation tape 7 includes a carriertape 8 having accommodation recesses 8 a formed at predeterminedintervals and a top tape 9 covering an upper surface carrier tape 8. ICchip 4 is accommodated in accommodation recess 8 a. In FIG. 4B, asillustrated on the right side, an upper part of accommodation recess 8 ais opened by peeling top tape 9 from carrier tape 8, so thataccommodated IC chip 4 can be taken out. IC chip 4 is accommodated inaccommodation recess 8 a in a state of being in an upward manner wherechip main body 6 is located above. Further, accommodation tape 7 hasfeed holes 7 a formed at even pitches along one side edge. Thisaccommodation tape 7 is reeled up by a supply reel 10.

Supply apparatus 3 includes a rotary support shaft 11 for freelyrotatably bearing-supporting supply reel 10, which is configured to reelup accommodation tape 7 described above in a rolled formed on its frontface, and supply reel 10 is set on rotary support shaft 11. Supplyapparatus 3 includes various rollers 12 for defining conveying routes ofaccommodation tape 7, separated carrier tape 8, and top tape 9 on theirfront faces, accommodation tape opening portion 13 capable of peelingtop tape 9 from carrier tape 8 and taking out IC chip 4 accommodated inaccommodation tape 7, a carrier tape collecting portion 14 forcollecting carrier tape 8 from which IC chip 4 is taken out, and a toptape collecting portion 15 for collecting top tape 9.

Accommodation tape opening portion 13 includes a guide plate 17constituting a conveying passage arranged in a horizontal direction at apredetermined position thereabove, a pair sprockets 18 arranged in frontand back in the conveying direction of accommodation tape 7 of guideplate 17, and a peeling plate 19 arranged at a predetermined positionabove guide plate 17.

As shown in FIGS. 5A to 5C in enlargement, guide plate 17 has a concavegroove extending in an axial direction in an upper surface. A width ofconcave groove 17 a is equal to or slightly larger than a tape width ofaccommodation tape 7. Therefore, accommodation tape 7 passes throughconcave groove 17 a, so that it stably moves forward without any lateraldisplacement. Further, as shown in FIGS. 5A to 5C and FIG. 6, in asection on an upstream side of guide plate 17, a slit 17 b is providedin a bottom portion of concave groove 17 a, and slit 17 b iscommunicated to a connection pipe 17 c mounted to a lower surface ofguide plate 17. Connection pipe 17 c is coupled to a suction pump notillustrated in the drawings. Accordingly, the part at which slit 17 b isopened in the bottom surface of concave groove 17 a causes a negativepressure to suction accommodation tape 7, so that stable conveyance canbe performed.

Moreover, sprockets 18 have protrusions 18 a at a predetermined pitch onits circumferential surface. When accommodation tape 7 is placed oversprockets 18, protrusions 18 a penetrate through feed holes 7 a ofaccommodation tape 7 and protrudes above accommodation tape 7.Accordingly, when sprockets 18 are rotated, protrusions 18 a within feedholes 7 a gives a conveying force to accommodation tape 7, andaccommodation tape 7 follows it and moves forward by a predeterminedamount. When sprockets 18 are stopped, the forward movement ofaccommodation tape 7 is also stopped. Sprockets 18 are in conjunctionwith an unillustrated drive motor such as a servo motor capable ofcontrolling a rotational angle, and an intermittent driving iscontrolled at a predetermined timing.

As schematically shown in FIG. 4B, a peeling plate 19 includes areference surface 19 a arranged in parallel with a conveyance surface ofaccommodation tape 7, and a slope surface 19 b sloping in a diagonallyrearward and upward direction from reference surface 19 a. Accommodationtape 7 passes through sprocket 18 on an upstream side, and thereafterpasses through a location between guide plate 17 and peeling plate 19,and top tape 9 is bent back from reference surface 19 a to slope surface19 b of peeling plate 19 and peeled from carrier tape 8. Accordingly,carrier tape 8 is opened on an upper side of accommodation recess 8 a.Then, carrier tape 8 is guided by guide plate 17 and moves horizontally.

It should be noted that, carrier tape 8 passes through accommodationtape opening portion 13 and thereafter passes through a predeterminedpassage to reach carrier tape collecting portion 14, and is taken up andcollected by a take-up reel. Similarly, peeled top tape 9 also passesthrough a predetermined passage to reach top tape collecting portion 15,and is taken up and collected by a take-up reel.

Above accommodation tape opening portion 13, IC chip take-out apparatus20 is provided. This IC chip take-out apparatus 20 has a function oftaking out IC chip 4 accommodated in opened accommodation tape 7,reversing an manner up and down, and passing it to conveying apparatus21 in a next stage. In the present embodiment, two front and back ICchips 4 accommodated in accommodation tape 7 are taken out collectively.Therefore, sprockets 18 and the like are operated so as tointermittently convey accommodation tape 7 by a pitch corresponding totwo IC chips 4, and performs a control of temporarily stopping IC chip 4in a state of being located at a take-out position of take-out apparatus20.

Then, IC chip take-out apparatus 20 includes a first suction and holdmember 22 for taking out IC chip 4 accommodated in accommodation tape 7and reversing up and down of IC chip 4, and a second suction and holdmember 23 for receiving IC chip 4 taken out and reversed by firstsuction and hold member 22 and supplying it to conveying apparatus 21.

First suction and hold member 22 has two first suction nozzle portions22 b formed to protrude at a leading end of an elongated belt-like mainbody 22 a. An arrangement interval of two first suction nozzle portions22 b matches with an arrangement pitch of IC chips 4 in accommodationtape 7. The leading ends of first suction nozzle portions 22 b areopened, and the opened parts are in communication with main body 22 aand suction passages 22 c formed within first suction nozzle portions 22b, and connected to a suction pump not illustrated in the drawing.

Moreover, this first suction and hold member 22 is configured to move upand down and rotate within a vertical plane. As illustrated inenlargement in FIGS. 5A to 5C, this first suction and hold member 22 isbearing-supported through a bearing 28 with respect to a moving plate 26moving up and down, and moves up and down with moving plate 26. On aback side of moving plate 26, sliders 24 are attached which is mountedto two guide rails 25 extending upward and downward so as to be movableup and down. Moving plate 26 is guided by guide rails 25 and sliders 24to stably move up and down. A drive mechanism for allowing moving plate26 to move up and down is configured such that one end of a beltplate-like coupling plate 31 is coupled to an eccentric position of arotating plate 30 receiving a rotational force of drive motor 33 torotate, and the other end of coupling plate 31 is coupled to movingplate 26. Accordingly, rotating plate 30 is rotated, so that couplingplate 31 and moving plate 26 move up and down. Then, moving plate 26reciprocates between the lifted position shown in FIGS. 1 and 5A to 5Cand a lowered position shown in FIG. 6.

Moreover, on a back side of moving plate 26, a drive motor 32 as a drivesource for rotating first suction and hold member 22 is attached, anddrive motor 32 also moves up and down integrally with moving plate 26. Arotational shaft 34 cooperating with an output shaft of drive motor 32is mounted to bearing 28 arranged so as to protrude to a front side ofmoving plate 26, and first suction and hold member 22 is fixed to aleading end of rotational shaft 34. Accordingly, rotation of drive motor32 causes first suction and hold member 22 to rotate. First suction andhold member 22 temporarily stops rotation in a passing manner having aleading end facing upward as shown in FIGS. 1 and 5A to 5C, and atake-out posture having a leading end facing downward as shown in FIG.6.

Accordingly, when drive motors 32, 33 are controlled appropriately toallow first suction and hold member 22 to be moved downward in a stateof a take-out manner of facing downward and located at a loweredposition, a leading end of first suction nozzle portion 22 b comes intocontact with IC chip 4 within accommodation tape 7 (FIGS. 6, 7A, and8A). When first suction nozzle portion 22 b communicates with anunillustrated suction pump in this state, suction is performed by firstsuction nozzle portion 22 b, so that first suction nozzle portion 22 bsuctions and holds IC chip 4.

Next, when moving plate 26 is moved up while having first suction andhold member 22 in a state of a take-out manner facing downward, firstsuction nozzle portion 22 b of first suction and hold member 22 islocated above accommodation tape 7 in a state of suctioning and holdingIC chip 4. Accordingly, an operation of taking out IC chip 4 fromaccommodation tape 7 is completed. Then, moving plate 26 and firstsuction and hold member 22 further moves up to reach the liftedposition. Before reaching this lifted position, first suction and holdmember 22 receives driving of drive motor 32 to rotate by 180 degrees,and shifts to a passing manner facing upward. Accordingly, IC chip 4suctioned by first suction nozzle portion 22 b of first suction and holdmember 22 is reversed up and down, an manner of facing downward is takenin which chip main body 6 is located on a lower side of base film 5.

As shown in FIGS. 5A to 5C and 7B, a cylindrical guide 40 is arranged atan existing position of first suction nozzle portion 22 b of firstsuction and hold member 22 at the time when first suction and holdmember 22 is in a passing manner of facing upward and located at thelifted position. This cylindrical guide 40 is coupled to a machine framethrough a support plate 48 extending in a horizontal direction and isfixedly arranged at a desired position. Cylindrical guide 40 includestwo through-holes 41 extending upward and downward. Two through-holes 41have parallel axis centers, and a pitch between axes matches with anarrangement pitch of first suction nozzle portion 22 b. Moreover, eachthrough-hole 41 has an inlet region 41 a at a lower end, a center region41 b, and an outlet region 41 c at an upper end. Inner diameterdimensions of inlet region 41 a and outlet region 41 c are set to besufficiently greater than outer shape dimensions of IC chip 4, and innershape dimensions of center region 41 b are set to be substantially equalto or greater than outside dimensions of IC chip 4. Further, an innercircumferential surface of center region 41 b is a tapered surfacehaving a narrowest center in an up/down direction. Then, when firstsuction and hold member 22 moves up while being in a state of a passingmanner facing upward, first suction nozzle portion 22 b enters inletregion 41 a from a lower end of cylindrical guide 40 to reach a liftedposition, a leading end of first suction nozzle portion 22 b is locatedwithin center region 41 b. More specifically, it is located near anarrowest center position within center region 41 b. Accordingly, theentering of IC chip 4 suctioned and held by first suction nozzle portion22 b into cylindrical guide 40 passes through inlet region 40 a having arelatively large room and moves within center region 41 b having agradually reduced inner diameter, so that it can move smoothly to thelifted position.

On the other hand, second suction and hold member 23 includes a firstmain body 23 a and a second main body 23 b which come close to andseparate from each other in a horizontal direction. Leading ends offirst and second main bodies 23 a, 23 b respectively have second suctionnozzle portions 23 c. An arrangement space of two second suction nozzleportions 23 c in a state where first main body 23 a and second main body23 b come close to each other matches with an arrangement space of firstsuction nozzle portion 22 b of first suction and hold member 22.Further, the leading end of second suction nozzle portion 23 c isopened, and the opening part communicates with first and second mainbodies 23 a, 23 b, and suction passages 23 d formed within secondsuction nozzle portions 23 c and is connected to an unillustratedsuction pump.

Moreover, this second suction and hold member 23 is configured to movewithin a three dimensional space. This movement is performed by a firstrobot 49. In other words, first robot 49 includes an arm 44 of a SCARArobot moving within a horizontal plane, a support rod 43 attached to alower surface of a leading end of arm 44 so as to be movable upward anddownward, and a base 42 attached to a lower end of support rod 43. Thehorizontal movement of arm 44 of this SCARA robot and the up and downmovement of support rod 43 causes base 42 to be movable to a desiredposition within the three dimensional space. Then, first main body 23 aand second main body 23 b constituting second suction and hold member 23is movably attached through a slider 23 e to guide rail 42 a provided ona lower surface of base 42. This movement of first main body 23 a andsecond main body 23 b is performed, for example, by cylinder driving.Accordingly, base 42 and second suction and hold member 23 supported onthe lower surface thereof move within the three dimensional space.Further, first main body 23 a and second main body 23 b come close toand separate from each other along guide rail 42 a.

Specifically, second suction and hold member 23 moves to a positionoverlapping with cylindrical guide 40 on a horizontal plane inaccordance with an operation of arm 44 of the SCARA robot, and movesdownward while maintaining that state, so that second suction and holdmember 23 reaches a lowered position. At this time, first main body 23 aand second main body 23 b are close to each other. In this state, asshown in FIGS. 5A to 5C, 7B, and 8B, second suction nozzle portion 23 centers outlet region 41 c from an upper end of cylindrical guide 40.Then, having reached a lowermost end position, the leading end of secondsuction nozzle portion 23 c is located within center region 41 b. Inthis state, it is controlled to come close to a leading end of firstsuction nozzle portion 22 b of first suction and hold member 22 locatedat the lifted position by a certain clearance (for example, about 0.5mm).

Accordingly, IC chip 4 suctioned and held by first suction nozzleportion 22 b waits in a state of being located in a center region 41 bof through-hole 41 of cylindrical guide 40, and a lower end of secondsuction nozzle portion 23 c of second suction and hold member 23 havingentered from above comes in contact with or close to IC chip 4. Then,suction with second suction nozzle portion 23 c is started, and suctionwith first suction nozzle portion 22 b is stopped at an appropriatetiming, so that suctioning and holding of IC chip 4 is shifted to theside of second suction and hold member 23.

As can be seen, the present embodiment is characterized in performing atransfer of IC chip 4 from first suction and hold member 22 to secondsuction and hold member 23 within cylindrical guide 40. Since IC chip 4has a thin shape of base film 5 with a small diameter of 3.5 mm, itcannot be firmly held by the suction and hold member. Therefore, ifpassing between first suction and hold member 22 and second suction andhold member 23 is performed in a state where IC chip 4 is exposed, thereis a likelihood that passing cannot be performed smoothly and IC chip 4is dropped. However, according to the present embodiment, the passingprocess is performed inside of cylindrical guide 40, so that the passingcan be performed assuredly.

After that, first suction and hold member 22 moves down whilemaintaining a passing manner. When first suction nozzle portion 22 bgoes out of cylindrical guide 40, first suction and hold member 22rotates by 180 degrees to take a take-out manner and returns to alowered position at an appropriate timing, and prepares for taking outnext IC chip. On the other hand, second suction and hold member 23 whichhas received IC chip 4 moves up with support rod 43 moving up, andsecond suction nozzle portion 24 is located above cylindrical guide 40.After that, an operation of arm 44 of the SCARA robot causes secondsuction and hold member 23 to move in a horizontal direction to reach aconveying position of conveying apparatus 21.

As shown in FIGS. 9A and 9B, conveying apparatus 21 includes a firstreceiving portion 45 and a second receiving portion 46 for receiving twoIC chips 4 conveyed by second suction and hold member 23 suctioning andholding IC chips 4, and a drive mechanism 47 for moving these firstreceiving portion 45 and second receiving portion 46 forward andbackward. As shown in FIG. 10A and 10B by enlargement, first receivingportion 45 includes recesses 45 b for accommodating IC chip 4 in uppersurfaces of two bifurcated pillar portions 45 a facing upward. A spacebetween pillar portions 45 a (recesses 45 b) is in conformity with atabletting machine in a next stage and set to be longer than anarrangement pitch (an arrangement space of first suction nozzle portion22 b and second suction and hold member 23) of IC chips 4 inaccommodation tape 7. Moreover, a bottom surface of recess 45 bcommunicates with a suction passage 45 formed within pillar portion 45 aand is connected to an unillustrated suction pump. Accordingly, IC chip4 set within recess 45 b is suctioned and held within recess 45 b. Evenwhen first receiving portion 45 moves forward, IC chip 4 moves forwardwith first receiving portion 45 while being set within recess 45 b.

Similarly, second receiving portion 46 includes recesses 46 baccommodating IC chip 4 in an upper surface of two bifurcated pillarportions 46 a facing upward. A space between pillar portions 46 a(recesses 46 b) is in conformity with a tabletting machine in a nextstage and set to be longer than an arrangement pitch (an arrangementspace of first suction nozzle portion 22 b and second suction and holdmember 23) of IC chip 4 in accommodation tape 7. Moreover, a bottomsurface of recess 46 bcommunicates with a suction passage 46 c formedwithin pillar portion 46 a and is connected to an unillustrated suctionpump. Accordingly, IC chip 4 set within recess 46 b is suctioned andheld within recess 46 b. Even when second receiving portion 46 movesforward, IC chip 4 moves forward with second receiving portion 46 whilebeing set in recess 46 b.

Drive mechanism 47 of first receiving portion 45 and second receivingportion 46 includes a drive motor 50, and a rack 51 and a pinion 52receiving an output of drive motor 50 and converting it into areciprocal linear motion. First receiving portion 45 and secondreceiving portion 46 cooperate with rack 51 respectively throughcoupling plates 53, 54 and move in a reverse direction. In other words,second receiving portion 46 moves backward when first receiving portion45 moves forward, and second receiving portion 46 moves backward whenfirst receiving portion 45 moves forward. In other words, for example,second receiving portion 46 is at a conveying-out position when firstreceiving portion 45 is at a conveying-in position. Moreover, forexample, second receiving portion 46 is at a conveying-in position whenfirst receiving portion 45 is at a conveying-out position. Moreover,sliders 55 are coupled to a lower surface of coupling plate 53 and anupper surface of coupling plate 54. This sliders 55 are mountedrespectively to corresponding guide rails 56 and guide a forward andbackward movement of rack 51 and each receiving portion 45, 46 alongwith rotation of pinion 52.

Second suction and hold member 23 having received IC chip 4 moves on ahorizontal plane by means of arm 44 of the SCARA robot and is locatedabove first receiving portion 45 or second receiving portion 46 locatedat the conveying-in position. As described above, since first receivingportion 45 and second receiving portion 46 move forward and backward indirections opposite to each other, first robot 49 controls an operationof arm 44 of the SCARA robot to allow second suction and hold member 23to be positioned alternately above the conveying-in position of firstreceiving portion 45 and the conveying-in position of second receivingportion 46.

As described above, since a space between pillar portions 45 a (recesses45 b) of first receiving portion 45 and a space between pillar portions46 a (recesses 46 b) of second receiving portion 46 are widened, firstrobot 49, during the horizontal movement of second suction and holdmember 23 by means of arm 44 of the SCARA robot or at the time of beinglocated above the conveying-in position, controls first main body 23 aand second main body 23 b of second suction and hold member 23 to beseparated from each other to widen the space of second suction nozzleportion 23 c. The widened space of second suction nozzle portion 23 c isset to be equal to the space of recesses 45 b, 46 b.

Then, in such a state where first main body 23 a and second main body 23b are separated from each other, when support rod 43 is moved downward,as shown in FIG. 10A for example, a lower end of second suction nozzleportion 23 c of second suction and hold member 23 enters recesses 45 bof first receiving portion 45, so that IC chip 4 suctioned and held in adownward manner is set within the recess 45 b. Then, when the suction onthe side of second suction and hold member 23 is released at anappropriate timing, IC chip 4 is transferred to recesses 45 b of firstreceiving portion 45. Moreover, first receiving portion 45 startssuction in advance or at an appropriate timing, and suctions and holdsIC chip 4 within recessed 45 b.

Second suction and hold member 23 having completed a supply of IC chip 4to first receiving portion 45 in such a manner returns to a receivingposition within cylindrical guide 40 by an operation of first robot 49,and supplies the next passed IC chip to recess 46 b of second receivingportion 46.

On the other hand, first receiving portion 45 having received the supplyof IC chip 4 moves forward and is located at a conveying-out position.IC chip 4 within recess 45 b of first receiving portion 45 havingreached the conveying-out position is suctioned and held by second robot70 and transferred to tabletting machine 2. Second robot 70 includes anarm 71 of the SCARA robot moving within a horizontal plane, a supportmember 72 attached to a leading end lower surface of arm 71 so as to bemovable upward and downward, and a pair of suction nozzle portions 73attached to the lower end of support member 72. A leading end of thirdsuction nozzle portion 73 is opened, and the opened part communicateswith suction passage 73 a formed within third suction nozzle portion 73and is connected to an unillustrated suction pump. Then, the horizontalmovement of arm 71 of the SCARA robot and the upward and downwardmovement of support member 72 causes third suction nozzle portions 73 tobe movable to a desired position within a three dimensional space.Further, a space of the pair of third suction nozzle portions 73 is inconformity with an arrangement space between pillar portions 45 a(recesses 45 b) of first receiving portion 45 and an arrangement spacebetween pillar portions 46 a (recesses 46 b) of second receiving portion46.

Accordingly, suction by means of a suction pump is performed in a statewhere a lower end of third suction nozzle portion 73 has reached withinrecess 45 b of first receiving portion 45 or recess 46 b of secondreceiving portion 46 located at the conveying-out position by means ofan operation of second robot 70. When the suction by means of a vacuumpump on the side of first receiving portion 45 or second receivingportion 46 is released, IC chip 4 is suctioned and held on the side ofthird suction nozzle portion 73 (refer to FIG. 10B).

Next, when third suction nozzle portion 73 suctioning and holding ICchip 4 is moved upward, horizontally, and downward by an operation ofsecond robot 70, as shown in FIGS. 2 and 11B, it is located within an ICchip receiving portion 79 of a rotary table 75 of an IC chip supplyapparatus 74 arranged on the conveying-in side of tabletting machine 2.When the suction of third suction nozzle portion 73 is released in thisstate, IC chip 4 is supplied to IC chip receiving portion 79.

Tabletting machine 2 includes the above-described IC chip supplyapparatus 74 and a tabletting machine main body 76. Tabletting machinemain body 76 is similar to a conventionally existing tabletting machinewhich fills pharmaceutical powder into a plurality of die holes 78arranged at predetermined intervals on a circumference along an outeredge portion of rotating plate 77 and compresses and shapes the filledpharmaceutical powder by means of a lower pestle and an upper pestle tomanufacture tablets. In the present embodiment, to manufacture an ICchip-containing tablet, a function of supplying IC chip 4 by means of ICchip supply apparatus 74 onto a predetermined amount of pharmaceuticalpowder supplied into die hole 78, further supplying pharmaceuticalpowder onto IC chip 4, and compressing and shaping these pharmaceuticalpowder and IC chip from above and below function is provided. Details ofmanufacturing processes of tablets will be described later.

IC chip supply apparatus 74 as a main part of the present inventionincludes rotary table 75 as described above, and aligns IC chips 4supplied to rotary table 75 within die holes 78 of tabletting machinemain body 76. Rotary table 75 receives a rotational force of drive motor60 to rotate. In the present embodiment, it is controlled to rotateintermittently at 90 degrees intervals. Moreover, rotary table 75includes protruding parts 75 b protruding outward at 90 degreesintervals on an outer circumference of a plate-like main body 75 a. Thisprotruding part 75 b is provided with IC chip receiving portions 79.From the side of supply apparatus 3, IC chips 4 are supplied inincrements of two, so that two IC chip receiving portions 79 areprovided at each protruding part 75 b. In the present embodiment, aposition rotated by 180 degrees from an IC chip receiving position fromsupply apparatus 3 on an upstream side is a supplying position of ICchips 4 to tabletting machine main body 76. Then, it is temporarilystopped at a position rotated by 90 degrees from the IC chip receivingposition. At this time, for example, it is favorable to provide aninspection apparatus which performs an inspection on whether or not ICchips are correctly supplied to IC chip receiving portion 59.

As shown in FIG. 12 by enlargement, a through-hole 75 b′ is providedwhich penetrates up and down at a specified position of protruding part75 b of rotary table 75, and a positioning guide 61 is mounted tothrough-hole 75 b′. This positioning guide 61 constitutes IC chipreceiving portion 59. Positioning guide 61 has a ring-like shape as abasic shape having a through hole penetrating up and down as also shownin FIGS. 13A to 13C.

Positioning guide 61 includes a flange portion protruding radiallyoutward at an upper circumferential side surface of cylindrical mainbody 62, and a convex portion 63 protruding upward is provided at acenter of the upper surface of main body 62. Convex portion 63 includesa flat surface 63 a on it side surface. Convex portion 63 is insertedinto through-hole 75 b′ of protruding part 75 b, and flange portion 63is sandwiched and held by protruding part 75 b and main body 75 a.Accordingly, movement in an axial direction of positioning guide 61, inother words, movement in an up/down direction is prevented, so thatseparation of positioning guide 61 from rotary table 75 is prevented.Further, an inner circumferential surface shape of through-hole 75 b′ ofprotruding part 75 b is set to be substantially match with an outercircumferential surface shape of convex portion 63 of positioning guide61. Accordingly, rotation of positioning guide 61 about an axis isprevented. Therefore, positioning guide 61 is held at a correct positionand in a correct manner by rotary table 75.

Through-hole 66 provided in positioning guide 61 is set to be a taperedsurface 66 a having a circular cross section in an upper region with adiameter gradually increasing as it goes upward. This upper region is aregion in which convex portion 63 is mainly formed. An inner diameter ofthrough-hole 66 at an upper end of convex portion 63 is set to be largerthan an outer diameter of IC chip 4. IC chip 4 suctioned and held bythird suction nozzle portion 73 enters into through-hole 66 ofpositioning guide 61 in accordance with a downward movement of thirdsuction nozzle portion 73 while tapered surface 66 a guides the enteringand prompts a smooth downward movement.

Moreover, the inner circumferential surface in the portion of main body62 of through-hole 66 forms a plurality of protrusions 67 protrudingtoward a center. In the present embodiment, five protrusions 67 areprovided. However, the number may be, for example, three, or othersuitable number may be used. The leading end position of protrusion 67is set to be located on an imaginary circumference being concentric withthrough-hole 66 and having a predetermined diameter. This predetermineddiameter is set be equal to or slightly smaller than a diameter of ICchip 4. Accordingly, a circumferential edge of IC chip 4 inserted intothrough-hole 66 of positioning guide 61 is supported by protrusion 67and held in a state where a center of IC chip 4 and a center ofpositioning guide 61 (through-hole 66) are matched. Accordingly, thepositioning is performed with a high accuracy. Moreover, it ispreferable to manufacture positioning guide 61 with an elastic body suchas rubber since it can hold IC chip 4 more firmly. Further, preferably,protrusion 67 is arranged at equal intervals in the circumferentialdirection. It is preferable since IC chips 4 are supported evenly.

Further, in the present embodiment, a push-in portion 64 protrudingdownward is provided at a lower surface of main body 62. A planar shapeof this push-in portion 64 is substantially elliptical as shown in FIG.13C. In this example, both ends on the large-diameter side of theelliptical shape is collapsed to be flat. The planar shape of thispush-in portion 64 is based on a shape of a tablet to be manufacturedand is formed to be slightly smaller than that of the tablet. In otherwords, it has a shape which is slightly smaller than a cross sectionalshape of die hole 78 formed in tabletting machine main body 76.Moreover, a circumferential surface of push-in portion 64 has a taperedsurface 64 a which is smaller on a lower side. Further, in the presentembodiment, protrusion 67 formed on the inner circumferential surface ofthrough-hole 66 is formed to a lower end of this push-in portion 64.

Next, an operation of supplying IC chip 4 from supply apparatus 3 to ICchip supply apparatus 74 and an operation of supplying IC chip 4 totabletting machine 2 will be described, and a configuration of IC chipsupply apparatus 74 will be described. FIGS. 14A and 15A show a statewhere a leading end of third suction nozzle portion 73 of supplyapparatus 3 is inserted into positioning guide 61 constituting IC chipreceiving portion 59. As shown in the drawings, second suction and holdmember 23 moves downward, and the leading end of third suction nozzleportion 73 in a state of suctioning and holding IC chip 4 enters intothrough-hole 66 of positioning guide 61 and stops at an appropriateposition of main body 62. At this appropriate position, IC chip 4 issupported by protrusion 67. Since the suction by third suction nozzleportion 73 is performed until reaching this stopping position, IC chip 4moves downward while maintaining a horizontal state in a downward mannerwhere chip main body 6 is located on a lower side, IC chip 4 is incontact with a plurality of protrusions 67 in a horizontal manner at alower stopping position of third suction nozzle portion 73.

Next, the suction by third suction nozzle portion 73 is released, andthird suction nozzle portion 73 moves upward and is separated frompositioning guide 61 to take next IC chip. On the other hand, IC chip 4in a downward manner remaining in positioning guide 61 is supported in astate of maintaining a horizontal manner by protrusions 67 ofpositioning guide 61. Moreover, as described above, taking of a centerposition of IC chip 4 is also performed at a high accuracy. The drawingssubsequent to FIG. 14B and 15B shows a supplying position to tablettingmachine 2 at which rotary table 75 is rotated by 180 degrees from thestates of FIGS. 14A and 15A. At this supplying position, two pushers 82are formed to be suspended on a lower surface of the leading end of anL-shaped plate 81 which receives driving of a first cylinder 80 andmoves up and down. Two pushers 82 are in conformity with the arrangementpitch of two positioning guides 61 which are adjacent in thecircumferential direction, and are adjusted so that an axis center ofeach positioning guide 61 and an axis center of pusher 82 are matched atthe time when the rotary table is temporarily stopped.

Further, first cylinder 80, L-shaped plate 81, pusher 82, and rotarytable 75 can move up and down integrally. Then, the up and down movementis performed by receiving driving of second cylinder 83.

Accordingly, the position of rotary table 75 or pusher 82 can be changedby appropriately switching the reciprocating operation of first cylinder80 and second cylinder 83. For example, FIGS. 14B and 15B shows a statewhere first cylinder 80, L-shaped plate 81, pusher 82, and rotary table75 are positioned at the lifted position by means of second cylinder 83,and where pusher 82 is also positioned at the lifted position by meansof first cylinder 80. In this state, rotary table 75 is separated froman upper surface of rotating plate 77 of tabletting machine main body76, and positioning guide 61 is also separated from an upper surface ofrotating plate 77. Moreover, the lower surface of pusher 82 is locatedabove positioning guide 61, and pusher 82 and IC chip 4 in a downwardmanner supported by positioning guide 61 are in a non-contact state.This state is an initial state of rotary table 75 which is rotated,reached the supplying position, and temporarily stopped.

Next, only second cylinder 83 is operated to allow first cylinder 80,L-shaped plate 81, pusher 82, and rotary table 75 to be positioned atthe lowered position. Then, as shown in FIGS. 14C and 15C, rotary table75 comes close to an upper surface of rotating plate 77 of tablettingmachine main body 76, and a lower surface of main body 62 of positioningguide 61 comes into contact with an upper surface of rotating plate 77.Further, push-in portion 64 enters die hole 78, and comes into contactwith pharmaceutical powder filled in die hole 78. Moreover, at thistime, since first cylinder 80 remains in the initial state, the relativepositional relationship between pusher 82 and positioning guide 61 doesnot change, and the lower surface of pusher 82 is located abovepositioning guide 61, and pusher 82 and IC chip 4 in a downward mannersupported by positioning guide 61 remain in a non-contact state.

After that, first cylinder 80 is operated while second cylinder 83maintains the above-described state, and pusher 82 moves downward. Then,as shown in FIGS. 14D and 15D, the lower end of pusher 82 reaches thelower end of positioning guide 61, in other words, the lower end ofpush-in portion 64, so that IC chip 4 is forced downward by pusher 82and pushed out from positioning guide 61 and pushed into pharmaceuticalpowder 90. Also at this downward movement of IC chip 4 by pusher 82, ICchip 4 moves while maintaining a horizontal state and taking out of acenter position by means of protrusions 67 of positioning guide 61.Accordingly, when IC chip 4 is pushed out from positioning guide 61 andfinally pushed into pharmaceutical powder 90 to be supplied, it issupplied at a high accuracy to a center of a surface of pharmaceuticalpowder 90 filled in die hole 78. Moreover, since IC chip 4 is pushedinto pharmaceutical powder 90 before being compressed by pusher 82 ofthe tabletting machine main body, the positional displacement issuppressed.

Further, since IC chip 4 is pushed into pharmaceutical powder 90 in adownward manner where chip main body 6 is located on a lower side, chipmain body 6 is further inserted into pharmaceutical powder 90 withrespect to the surface of pharmaceutical powder 90 in contact with, forexample, base film 5. Therefore, even when IC chip 4 attempts to move inthe horizontal direction, chip main body 6 serves as a wedge, so thatthe positional displacement due to the movement in the lateral directioncan be suppressed assuredly.

Further, in the present embodiment, as described above, the horizontalstate and the taking of the center position is performed at a highaccuracy by means of protrusions 67 of positioning guide 61. Thus, sinceIC chip 4 can be supplied assuredly to the center of pharmaceuticalpowder 90, the taking of the position is ensured without performing aninspection on whether or not IC chip 4 is supplied to a correct positionafter the supply. Accordingly, even in the case where an inspectionapparatus is provided, it may be for example a simple sensor whichconfirms presence of supply, so that an apparatus which cannot reserve aspace region for providing the inspection apparatus can be used.

FIGS. 16A to 20C represent an operation of a main body of tablettingmachine 2. As shown in FIG. 16A, on the lower side of die hole 78, alower pestle 92 is fitted from a lower side in a slidably upward anddownward. As shown in FIG. 20A, on an upper side of die hole 78, anupper pestle 93 is provided so as to be movable up and down. As shown inFIG. 16A, firstly, in a state where lower pestle 92 is lowered in diehole 78, pharmaceutical powder filling apparatus 94 fills pharmaceuticalpowder 90 into die hole 78. Next, as lower pestle 92 moves upward, asupply by pharmaceutical powder filling apparatus 94 is cut, and acertain amount of pharmaceutical powder 90 is filled in a leveled stateinto a space of die hole 78 formed in an upper side of lower pestle 92(FIG. 16B). After that, lower pestle 92 is lowered by a predeterminedquantity, so that the surface of pharmaceutical powder 90 is slightlylowered from an upper surface of rotating plate 75 (FIG. 17A).

In this state, with IC chip supply apparatus 74 described above,positioning guide 61 having IC chip 4 set in a downward manner entersdie hole 78 (FIG. 17B), and pusher 82 pushes out IC chip 4 and pushes itinto pharmaceutical powder 90 (FIG. 18A).

Next, rotating plate 75 is rotated to allow the die hole located at thesupplying position to shift to the next step (FIG. 18B), andpharmaceutical powder 90 is filled into die hole 78 by pharmaceuticalpowder filling apparatus 94 in a state where lower pestle 92 ispositioned on a lower side within die hole 78 (FIG. 19A). Next, lowerpestle 92 is lifted, and a supply by pharmaceutical powder fillingapparatus 94 is cut, and a certain amount of pharmaceutical powder 90 isfilled in a space of die hole 78 formed on an upper side of lower pestle92 in a leveled state (FIG. 19B).

Next, upper pestle 93 is lowered, and pharmaceutical powder 90 iscompressed between upper pestle 93 and lower pestle 92 (FIG. 20A).Accordingly, pharmaceutical powder 90 is solidified, so that ICchip-containing tablet 95 is manufactured (FIG. 20B). After that, lowerpestle 92 is further moved upward, so that manufactured tablet 95 isdischarged (FIG. 20C). In a pharmaceutical tablet 95 containing IC chip4 equipped with an IC, tablet 95 includes a first surface 95 a and asecond surface 95 b spaced from each other in the up/down direction. Anengraved stamp or cleavage line 95 c which is deeper than second surface95 b is formed in first surface 95 a. IC chip 4 has base film 5 as abase plane, and a chip main body 6 as a convex portion protrudinggreater on one side than the other side with respect to base film 5, andchip main body 6 is arranged within tablet 95 while facing the side ofsecond surface 95 b (FIG. 20D). It is not always necessary to form anengraved stamp or a cleavage line in second surface 95 b.

A tablet 95 as a medicine is often formed to have an engraved stamp or acleavage line representing a kind or a bland name. Generally, such anengraved stamp or cleavage line 95 c is formed on one or both of upperand lower sides of tablet 95. Taking into consideration the mold releasecharacteristics from a tabletting machine at the time of manufacturing,a deeper engraved stamp/cleavage line 95 c (engraved stamp/cleavage line95 c in a case where it is formed only on one side) is formed in anupper pestle. In the present embodiment, since IC chip 4 is insertedinto a die of the tabletting machine in a downward manner, the convexportion in IC chip 4 faces a side opposite to a tablet surface appliedwith a deeper engraved stamp/cleavage line.

In first surface 95 a, an engraved stamp or cleavage line 95 c isformed. In second surface 95 b, an engraved stamp or cleavage line isnot formed, or an engraved stamp or cleavage line shallower than firstsurface 95 a is formed. Chip main body 6 is arranged in a medical tabletwhile facing the side of second surface 95 b. Therefore, IC chip 4 isequipped without a positional displacement. Consequently, a breakage orcrack due to the positional displacement of IC chip 4 (for example,exposure of IC chip 4 to the side surface of tablet 95) can beprevented. Further, it is preferable that a center of IC chip 4 in athickness direction is located at a center of tablet 95 in a thicknessdirection. Specifically, it is preferable that a center of IC chip 4 inthe thickness direction is located at an intermediate position betweenfirst surface 95 a and second surface 95 b.

<Modified Example>

Push-in portion 64 is not always necessary. Without providing push-inportion 64, IC chip 4 may be pushed out with a pusher in a state where alower surface of main body 62 is in contact with an upper surface ofrotating plate 75. In this case, the pharmaceutical powder within thedie hole may be filled to an upper end of the die hole to be in aleveled state. In this case, IC chip 4 is not pushed into pharmaceuticalpowder 90 but is placed on pharmaceutical powder 90.

Moreover, in a case where push-in portion 64 is provided as in theabove-described embodiment, push-in portion 64 may enter die hole 78 andfurther push in the pharmaceutical powder filled in die hole 78.Accordingly, on the surface of the pharmaceutical powder, an inner shaperecess matching with an outer shape of push-in portion 64 is formed.Therefore, since IC chip 4 is set in the recess, the positionaldisplacement due to the movement in the lateral direction can besuppressed assuredly.

Even in the case where the protrusion is provided, the protrusion is notalways necessary to be formed to a lower end of positioning guide 61,and it may be omitted at the lower end. In such a case, for example, theprotrusion may be formed only in the main body portion, and it may beomitted at all of or a part of the portion corresponding to the push-inportion.

It should be noted that, although positioning guide 61 includingprotrusion 67 in the inner circumferential surface is provided, and thepusher is pushed out in the state where IC chip 4 is set in positioningguide 61 in the above-described embodiment, the present invention is notlimited to this. For example, a positioning guide without a protrusionmay be used. Moreover, suction means may be used in place of the pusher,so that the IC chip suctioned by suction means is supplied so as to bepushed into the pharmaceutical powder within the die hole.

Moreover, although the IC chip is supplied to the pharmaceutical powderin a downward manner in the above-described embodiment, the IC chip maybe supplied in an upward manner.

FIG. 21 is a front view representing a favorable one embodiment of atablet manufacturing apparatus according to the present invention. FIGS.22 and 23 are plan views thereof. FIGS. 24A to 24C are drawings forexplaining an IC chip to be supplied in the present embodiment. Thedrawings subsequent to FIGS. 24A to 24C are enlarged views of each partof the apparatus and for explaining an effect.

As shown in FIGS. 21 to 23, a tablet manufacturing apparatus accordingto the present embodiment includes a tabletting machine 1002, and asupply apparatus 1003 for conveying and supplying an IC chip totabletting machine 1002. As shown in FIGS. 24A to 24C, an IC chip 1004which is conveyed and supplied in the present embodiment is in a formhaving a chip main body 1006 mounted at a center position of a circularbase film 1005. Base film 1005 has, for example, a disk-like outer shapewith a diameter of 3.5 mm, and includes, for example, a function forsupporting chip main body 6 and an antenna function for performingtransmission of information with outside. Chip main body 1006 has, forexample, a rectangular outer shape of 1 mm square, and an electroniccircuit is incorporated therein. Chip main body 1006 includes, forexample, a storage portion for storing information specifying a tabletto which IC chip 1004 is buried, and a function for transmittinginformation stored in the storage portion at a predetermined timing.

As shown in FIGS. 24A and 24B, IC chips 1004 having the above-describedconfiguration are accommodated in a belt-like accommodation tape 1007 inone line at predetermined intervals. Accommodation tape 1007 includes acarrier tape 8 having accommodation recesses 1008 a formed atpredetermined intervals, and a top tape 1009 covering an upper surfaceof carrier tape 1008. IC chips 1004 are accommodated withinaccommodation recesses 1008 a. In FIG. 24B, as shown on the right side,top tape 1009 is peeled from carrier tape 1008, so that the upper sideof accommodation recesses 1008 a are opened, so that accommodated ICchips 1004 can be taken out. IC chip 1004 are accommodated in a state ofbeing in an upward manner where chip main body 1006 is located in anupper part of accommodation recess 1008 a. Further, accommodation tape1007 has feed holes 1007 a formed at equal pitch along one side edge.This accommodation tape 1007 is taken up by a supply reel 1010.

Supply apparatus 1003 includes a rotary support shaft 1011 which freelyrotatably bearing-supports supply reel 1010 configured to take up on itsfront face the above-described accommodation tape 1007 in a rolled form,and supply reel 1010 is set on rotary support shaft 1011. Supplyapparatus 1003 includes various rollers which define on their frontfaces conveying passages for accommodation tape 1007 or separatedcarrier tape 1008 and top tape 1009, an accommodation tape openingportion 1013 which allows top tape 1009 to be peeled off from carriertape 1008 and allows IC chip 1004 accommodated in accommodation tape1007 to be taken out, a carrier tape collecting portion 1014 whichcollects carrier tape 1008 from which IC chip 1004 is taken out, and atop tape collecting portion 1015 which collects top tape 1009.

Accommodation tape opening portion 1013 includes a guide plate 1017constituting a conveying path arranged at a predetermined position on anupper side in a horizontal direction, a pair of sprockets 1018 arrangedon front and back sides in the conveying direction of accommodation tape1007 of guide plate 1017, and a peeling plate 1019 arranged at apredetermined position on an upper side of guide plate 1017.

As shown in FIGS. 25A to 25C by enlargement, guide plate 1017 isprovided with a recessed groove 1017 a extending in an axial directionon an upper surface. A width of recessed groove 1017 a is equal to orslightly larger than a tape width of accommodation tape 1007.Accordingly, accommodation tape 1007 passes through recessed groove 1017a, so that it moves forward stably without any lateral displacement.Further, as shown in FIGS. 25A to 25C and 26, in a section on anupstream side of guide plate 1017, a slit 1017 b is provided in a bottomportion of recessed groove 1017 a, and slit 1017 b communicates with aconnection pipe 1017 c mounted to a lower surface of guide plate 1017.Connection pipe 1017 c cooperates with an unillustrated suction pump.Accordingly, a part of the bottom portion of recessed groove 1017 a atwhich slit 1017 b is opened generates a negative pressure, so thataccommodation tape 1007 can be suctioned and conveyed stably.

Moreover, sprocket 1018 has protrusions 1018 a on its circumferentialsurface at a predetermined pitch. When accommodation tape 1007 is passedover sprockets 1018, protrusion 1018 a penetrates through feed holes1007 a of accommodation tape 1007 and protrudes above tape 1007.Accordingly, when sprockets 1018 are rotated, protrusions 1018 a withinfeed holes 1007 a gives a conveying force to accommodation tape 1007,and accommodation tape 1007 follows it and moves forward by apredetermined amount, and the forward movement of accommodation tape1004 is stopped when sprockets 1018 are stopped. Sprockets 1018cooperates with a drive motor such as a servo motor, which is notillustrated in the drawings, for which a rotational angle can becontrolled, and an intermittent driving is controlled at a predeterminedtiming.

As schematically shown in FIG. 24B, peeling plate 1019 includes areference surface 1019 a arranged in parallel with a conveying surfaceof accommodation tape 1007, and a slope surface 1019 b which slopestoward a diagonally backward direction from reference surface 1019 a.Accommodation tape 1007 passes through sprocket 1018 on an upstream sideand thereafter passes through a location between guide plate 1017 andpeeling plate 1019, and top tape 1009 is folded back from referencesurface 1019 a to slope surface 1019 b of peeling plate 1019 and peeledoff from carrier tape 1008. Accordingly, carrier tape 1008 is opened onan upper side of accommodation recess 1008 a. Then, carrier tape 1008 isguided by guide plate 1017 and moves horizontally.

It should be noted that carrier tape 1008 passes through accommodationtape opening portion 1013 and thereafter passes through a predeterminedpassage to reach carrier tape collecting portion 1014, and then is takenup and collected by a take-up reel. Similarly, peeled top tape 1009 alsopasses through a predetermined passage to reach top tape collectingportion 1015, and is taken up and collected by a take-up reel.

Above accommodation tape opening portion 1013, an IC chip take-outapparatus 1020 is provided. This IC chip take-out apparatus 1020 has afunction of taking out an IC chip 1004 accommodated in openedaccommodation tape 1007, reversing an manner upside down, and passing ICchip 1004 to a conveying apparatus 21 in the next stage. In the presentembodiment, two front and back IC chips 1004 accommodated inaccommodation tape 1007 are taken out collectively. Accordingly,sprockets 1018 and the like are operated so as to intermittently conveyaccommodation tape 1007 at a pitch for two IC chips 1004, and iscontrolled to temporarily stop in a state where IC chips 1004 arelocated at a take-out position of IC chip take-out apparatus 1020.

Then, IC chip take-out apparatus 1020 includes a first suction and holdmember 1022 for taking out IC chip 1004 accommodated in accommodationtape 1007 and reversing IC chip 1004 upside down, and a second suctionand hold member 1023 for receiving IC chip 1004 taken out and reversedby first suction and hold member 1022 and supplying IC chip 1004 toconveying apparatus 1021.

First suction and hold member 1022 is formed to have two first suctionnozzle portions 1022 b protruding at a leading end of an elongatedbelt-like main body 1022 a. An arrangement space of two first suctionnozzle portions 1022 b matches with an arrangement pitch of IC chips1004 in accommodation tape 1007. The leading end of first suction nozzleportion 1022 b is opened, and the opened part communicates with asuction passage 1022 c formed within main body 1022 a and first suctionnozzle portion 1022 b and is connected to an unillustrated suction pump.

Moreover, this first suction and hold member 1022 is configured to moveupward and downward and rotate within a vertical plane. As shown inFIGS. 25A to 25C by enlargement, this first suction and hold member 1022is bearing-supported through bearing 1028 with respect to moving plate1026 moving upward and downward and it moves upward and downward withmoving plate 1026. On a back side of moving plate 1026, sliders 1024 areattached which are movable in upward and downward directions withrespect to two guide rails 1025 extending upward and downward. Movingplate 1026 is guided by guide rails 1025 and sliders 1024 and movesupward and downward stably. A drive mechanism for allowing this movingplate 1026 upward and downward is configured to couple one end ofbelt-like coupling plate 1031 to an eccentric position of rotating plate1030 which receives a rotational force of drive motor 1033 to rotate,and couple the other end of coupling plate 1031 to moving plate 1026.Accordingly, rotation of rotating plate 1030 moves coupling plate 1031and moving plate 1026 upward and downward. Then, moving plate 1026reciprocates between a lifted position shown in FIGS. 21 and 25A to 25Cand a lowered position shown in FIG. 26.

Moreover, on a back side of moving plate 1026, a drive motor 1032 isattached which is a drive source for rotating first suction and holdmember 1022, and drive motor 1032 also moves upward and downwardintegrally with moving plate 1026. A rotational shaft 1034 cooperatingwith an output shaft of drive motor 1032 is mounted to bearing 1028arranged so as to protrude on the front face side of moving plate 1026,and first suction and hold member 1022 is fixed to a leading end ofrotational shaft 1034. Accordingly, rotation of drive motor 1032 alsorotates first suction and hold member 1022. Then, first suction and holdmember 1022 temporarily stops rotation in two manners: a passing mannerin which the leading end faces upward as shown in FIGS. 21 and 25A to25C; and a take-out manner in which the leading end faces downward asshown in FIG. 26.

Accordingly, when drive motors 1032, 1033 are appropriately controlledto allow first suction and hold member 1022 to be moved downward in adownward take-out manner and positioned at a lowered positioned, aleading end of first suction nozzle portion 1022 b comes into contactwith IC chip 1004 within accommodation tape 1007 (FIGS. 26, 27A, and28A). When first suction nozzle portion 1022 b communicates with anunillustrated suction pump in this state, suction by first suctionnozzle portion 1022 b is performed, so that first suction nozzle portion1022 b suctions and holds IC chip 1004.

Next, when moving plate 1026 is moved upward while maintaining firstsuction and hold member 1022 to be in a downward take-out manner, firstsuction nozzle portion 1022 b of first suction and hold member 1022 ispositioned above accommodation tape 1007 in a state of suctioning andholding IC chip 1004. Accordingly, taking out IC chip 1004 fromaccommodation tape 1007 is completed. Then, moving plate 1026 and firstsuction and hold member 1022 are further moved upward to reach thelifted position. Before reaching this lifted position, first suction andhold member 1022 receives driving of drive motor 1032, so that it isrotated by 180 degrees and shifted to an upward passing manner.Accordingly, IC chip 1004 suctioned by first suction nozzle portion 1022b of first suction and hold member 1022 is reversed upside down, so thatchip main body 1006 takes a downward manner of being located on a lowerside of base film 1005.

As shown in FIGS. 25A to 25C and 27B, a cylindrical guide (guide member)1040 is arranged at a position where first suction nozzle portion 1022 bof first suction and hold member 22 is located when first suction andhold member 1022 is at a lifted position in a passing manner of facingupward. This cylindrical guide 1040 is coupled to a machine framethrough a support plate 1048 extending in a horizontal direction and isfixedly arranged at a desired position. Cylindrical guide 1040 includestwo through-holes 1041 extending upward and downward. Two through-holes1041 have parallel axis centers, and a pitch between the axes matcheswith an arrangement pitch of first suction nozzle portion 1022 b.Moreover, each through-hole 1041 includes an inlet region 1041 a at alower end, a center region 1041 b, and an outlet region 1041 c at anupper end. Inner shape dimensions of inlet region 1041 a and outletregion 1041 c are set to be sufficiently greater than outer shapedimensions of IC chip 1004, and inner shape dimensions of center region1041 b are set to be substantially equal to or greater than outer shapedimensions of IC chip 1004. Further, the inner circumferential surfaceof center region 1041 b is set to be a tapered shape having a narrowestcenter in the up/down direction. Then, when first suction and holdmember 1022 moves upward while maintaining a passing manner of facingupward, first suction nozzle portion 1022 b enters inlet region 1041 afrom a lower end of cylindrical guide 1040, and a leading end of firstsuction nozzle portion 1022 b is positioned within center region 1041 bwhen it reaches a lifted position. More specifically, it is positionednear a narrowest center position within center region 1041 b.Accordingly, entering of IC chip 1004 suctioned and held by firstsuction nozzle portion 1022 b into cylindrical guide 1040 passes throughrelatively large inlet region 1040 a and moves within center region 1041b having a gradually reduced inner diameter, so that it can move to thelifted position smoothly.

On the other hand, second suction and hold member 1023 includes a firstmain body 1023 a and second main body 1023 b which come close to andseparate from each other in a horizontal direction. The leading ends offirst and second main bodies 1023 a-1023 b respectively include secondsuction nozzle portions 1023 c. An arrangement space of two secondsuction nozzle portions 1023 c in a state where first main body 1023 aand second main body 1023 b come close to each other is set to mach withan arrangement space of first suction nozzle portion 1022 b of firstsuction and hold member 1022. Further, the leading ends of secondsuction nozzle portions 1023 c are opened, and the opened partscommunicate with suction passages 1023 d formed within first and secondmain bodies 1023 a, 1023 b and second suction nozzle portions 1023 c andare connected to an unillustrated suction pump.

Moreover, this second suction and hold member 1022 is configured to movewithin the three-dimensional space. This movement is performed by afirst robot 1049. In other words, first robot 1049 includes an arm 1044of a SCARA robot moving within a horizontal plane, a support rodattached to a leading end lower surface of arm 1044 so as to be movablein upward and downward directions, and a base 1042 attached to the lowerend of support rod 1043. The horizontal movement of arm 1044 of theSCARA robot and the upward and downward movement of support rod 1043allows base 1042 to be moved to a desired position within a threedimensional space. Then, first main body 1023 a and second main body1023 b constituting second suction and hold member 1023 are movablyattached to guide rails 1042 a provided at a lower surface of base 1042through sliders 1023 e. The movement of first main body 1023 a andsecond main body 1023 b is performed by, for example, a cylinderdriving. Accordingly, second suction and hold member 1023 supported bybase 1042 and its lower surface move within the three dimensional space.Further, first main body 1023 a and second main body 1023 b come closeto and separate from each other along guide rails 1042 a.

Specifically, second suction and hold member 1023 follows the operationof arm 1044 of the SCARA robot and moves to a position overlapping withcylindrical guide 1040 in the horizontal plane, and support rod 1043 islowered while maintaining that state, so that second suction and holdmember 1023 reaches a lowered position. At this time, first main body1023 a and second main body 1023 b are set to come close to each other.In this state, as shown in FIGS. 25A to 25C, 27B, and 28B, secondsuction nozzle portions 1023 c enter outlet region 1041 c from an upperend of cylindrical guide 1040. Then, after having reached a lowest endposition, the leading ends of the second suction nozzles 1023 c arepositioned within center region 1041 b. In this state, a control isperformed to come close to a leading end of first suction nozzle portion1022 b of first suction and hold member 1022 located at the liftedposition with a certain clearance (for example, 0.5 mm).

Accordingly, IC chip 1004 suctioned and held by first suction nozzleportion 1022 b waits in a state of being located in center region 1041 bof through-hole 1040 of cylindrical guide 1040, and lower ends of secondsuction nozzle portions 1023 c of second suction and hold members 1023having entered the cylindrical guide 1030 from above comes into contactwith or close to IC chip 1004. Then, suction by second suction nozzleportion 1023 c is started and suction by first suction nozzle portion1022 b is stopped at an appropriate timing, so that suctioning andholding of IC chip 1004 is shifted to the side of second suction andhold member 1023.

As can be seen, the present embodiment is characterized in performingthe transfer of IC chip 1004 from first suction and hold member 1022 tosecond suction and hold member 1023 within cylindrical guide 1040. SinceIC chip 1004 has a small diameter of, for example, 3.5 mm, and has athin shape of base film 1005, it cannot be firmly held by a suction andhold member. Therefore, if the passing from first suction and holdmember 1022 to second suction and hold member 1023 is performed in astate where IC chip 1004 is exposed, IC chip 1004 is displaced whensuction by first and second suction nozzle portion 1022 b, 1023 b isswitched. Accordingly, the passing cannot be performed smoothly, and ICchip 1004 may be dropped. However, according to the present embodiment,since the passing process is performed inside of cylindrical guide 1040,passing can be performed assuredly.

After that, first suction and hold member 1022 moves downward whilemaintaining the passing manner. When first suction nozzle portion 1022 bgoes out of cylindrical guide 1040, first suction and hold member 1022rotates by 180 degrees and returns to a lowered position at anappropriate timing, and prepares for next operation of taking out the ICchip. On the other hand, second suction and hold member 1023 havingreceived IC chip 1004 moves upward along with lifting of support rod1043, and second suction nozzle portion 1024 is located abovecylindrical guide 1040. After that, by the operation of arm 1044 of theSCARA robot, second suction and hold member 1023 moves in a horizontaldirection and reaches a conveying-in position of conveying apparatus1021.

As shown in FIGS. 29A and 29B, conveying apparatus 1021 includes a firstreceiving portion 1045 and a second receiving portion 1046 for receivingtwo IC chips 1004 suctioned, held, and conveyed by second suction andhold member 1023, and a drive mechanism 1047 for allowing these firstreceiving portion 1045 and second receiving portion 1046 to move forwardand backward. As shown in FIGS. 30A and 30B by enlargement, firstreceiving portion 1045 includes recesses 1045 b for accommodating ICchips 1004 in upper surfaces of two pillar portions 1045 a facing upwardand separated into two legs. A space between pillar portions 1045 a(recesses 1045 b) is in conformity with the tabletting machine in thenext stage, and is set to be longer than an arrangement pitch of ICchips 1004 in accommodation tape 1007 (an arrangement interval of firstsuction nozzle portion 1022 b and second suction and hold member 1023).Moreover, a bottom surface of recess 1045 b communicates with a suctionpassage 1045 c formed within pillar portion 1045 a and is connected toan unillustrated suction pump. Accordingly, IC chip 1004 set withinrecess 1045 b is suctioned and held within recess 1045 b. Even whenfirst receiving portion 1045 moves forward, IC chip 1004 moves forwardwith first receiving portion 1045 while being set within recess 1045 b.

Similarly, second receiving portion 1046 includes recesses 1046 b foraccommodating IC chips 1004 on an upper surface of two pillar portions1046 a separated to be two legs facing upward. A space of pillarportions 1046 a (recesses 1046 b) is in conformity with the tablettingmachine in the next stage and set to be longer than an arrangement pitchof IC chips 1004 in accommodation tape 1007 (an arrangement space offirst suction nozzle portion 1022 b and second suction and hold member1023). Moreover, the bottom surface of recess 1046 b communicates with asuction passage 1046 c formed within pillar portion 1046 a and isconnected to an unillustrated suction pump. Accordingly, IC chip 1004set within recess 1046 b is suctioned and held by recess 1046 b. Evenwhen second receiving portion 1046 moves forward, IC chip 1004 movesforward with second receiving portion 1046 while being set within recess1046 b.

Drive mechanism 1047 for first receiving portion 1045 and secondreceiving portion 1046 includes a drive motor 1050, and a rack 1051 anda pinion 1052 which receive an output of drive motor 1050 and convertsit into a reciprocating linear motion. First receiving portion 1045 andsecond receiving portion 1046 cooperate with rack 1051 throughrespective coupling plates 1053, 1054 and move in reverse directions. Inother words, when first receiving portion 1045 moves forward, secondreceiving portion 1046 moves backward. When first receiving portion 1045moves forward, second receiving portion 1046 moves backward. Forexample, when first receiving portion 1045 is at a conveying-inposition, second receiving portion 1046 is at a conveying-out position.Moreover, for example, when first receiving portion 1045 is at aconveying-out position, second receiving portion 1046 is at aconveying-in position. Moreover, sliders 1055 are coupled to a lowersurface of coupling plate 1053 and an upper surface of coupling plate1054. Sliders 1055 are mounted respectively to corresponding guide rails1056, and guides forward and backward movement of rack 1051 and eachreceiving portion 1045, 1046 with the rotation of pinion 1052.

Second suction and hold member 1023 having received IC chip 1004 moveswithin a horizontal plane by arm 1044 of the SCARA robot, and ispositioned above first receiving portion 1045 or second receivingportion 1046 located at the conveying-in position. As described above,since first receiving portion 1045 and second receiving portion 1046move forward and backward in directions opposite to each other, firstrobot 1049 controls an operation of arm 1044 of the SCARA robot, andallows second suction and hold member 1023 to be alternately positionedabove the conveying-in position of first receiving portion 1045 andabove the conveying-in position of second receiving portion 1046.

As described above, since a space between pillar portions 1045 a(recesses 1045 b) of first receiving portion 1045 and a space betweenpillar portions 1046 a (recesses 1046 b) of second receiving portion1046 are set to be wide, first robot 1049 controls first main body 1023a and second main body 1023 b of second suction and hold member 1023 tobe separated apart to widen the space of second suction nozzle portion1023 c during the horizontal movement of second suction and hold member1023 by arm 1044 of the SCARA robot or at the time of being positionedabove the conveying-in position. This widened space of second suctionnozzle 1023 c is set to be equal to the space of recesses 1045 b, 1046b.

Then, when support rod 1043 is moved downward in a state where firstmain body 1023 a and second main body 1023 b are separated apart, forexample, as shown in FIG. 30A, the lower end of second suction nozzleportion 1023 c of second suction and hold member 1023 enters recess 1045b of first receiving portion 1045, so that IC chip 1004 suctioned andheld in a downward manner is set within recess 1045 b. The, when thesuction on the side of second suction and hold member 1023 is releasedat an appropriate timing, IC chip 1004 is transferred to recess 1045 bof first receiving portion 1045. Moreover, first receiving portion 1045starts the suction in advance or at an appropriate timing, and suctionsand holds IC chip 1004 within recess 1045 b.

Second suction and hold member 1023 having completed a supply of IC chip1004 to first receiving portion 1045 in such a manner returns to apassing position within cylindrical guide 1040 by the operation of firstrobot 1049 and supplies a next passed IC chip to recess 1046 b of secondreceiving portion 1046.

On the other hand, first receiving portion 1045 having received a supplyof IC chip 1004 moves forward and is positioned at a conveying-outposition. IC chip 1004 within recess 1045 b of first receiving portion1045 having reached the conveying-out position is suctioned and held bysecond robot 1070 and transferred to tabletting machine 1002. Secondrobot 1070 includes an arm 1071 of the SCARA robot moving within thehorizontal plane, a support member 1072 attached movably upward anddownward on the leading end lower surface of arm 1071, and a pair ofthird suction nozzle portion 1073 attached to a lower end of supportmember 1072. A leading end of third suction nozzle portion 1073 isopened, and the opened part communicates with suction passage 1073 aformed within third suction nozzle portion 1073 and is connected to anunillustrated suction pump. Then, by the horizontal movement of arm 1071of the SCARA robot, and the upward and downward movement of supportmember 1072, third suction nozzle portion 1073 can move to a desiredposition within the three dimensional space. Further, a space of thepair of third suction nozzle portion 1073 matches with an arrangementspace of pillar portions 1045 a (recesses 1045 b) of first receivingportion 1045 and pillar portions 1046 a (recesses 1046 b) of secondreceiving portion 1046.

Therefore, the suction by means of the suction pump is performed in astate where a lower end of third suction nozzle portion 1073 reachesrecess 1045 b of first receiving portion 1045 or recess 1046 b of secondreceiving portion at the conveying-out position by the operation ofsecond robot 1070. When the suction by the vacuum pump on the side offirst receiving portion 1045 or second receiving portion 1046 isreleased, IC chip 1004 is suctioned and held on the side of thirdsuction nozzle portion 1073 (refer to FIG. 30B).

Next, by the operation of second robot 1070, third suction nozzleportion 1073 suctioning and holding IC chip 1004 performs the upwardmovement, the horizontal movement, and the descending movement, so that,as shown in FIGS. 22 and 31B, it is positioned within IC chip receivingportion 1079 of rotary table 1075 of IC chip supply apparatus 1074arranged on the conveying-in side of tabletting machine 1002. When thesuction by third suction nozzle portion 1073 is released in this state,IC chip 1004 is supplied into IC chip receiving portion 1079.

Tabletting machine 1002 includes IC chip supply apparatus 1074 andtabletting machine main body 1076 described above. Tabletting machinemain body 1076 is similar to the conventionally existing tablettingmachine, and it fills pharmaceutical powder into a plurality of dieholes 1078 provided at predetermined intervals on a circumference alongthe outer edge portion of rotating plate 1077 and compresses and shapesthe filled pharmaceutical powder by means of a lower pestle and an upperpestle to manufacture a tablet. In the present embodiment, in order tomanufacture an IC chip-containing tablet, a function of firstlysupplying IC chip 1004 by means of IC chip supply apparatus 1074 onto apredetermined amount pharmaceutical powder supplied to die hole 1078,further filling pharmaceutical powder onto IC chip 1004, and thereaftercompressing and shaping these pharmaceutical powder and IC chip fromabove and below. Details of the manufacturing processes for tablets willbe described later.

IC chip supply apparatus 1074 as a main part of the present inventionincludes rotary table 1075 described above, and aligns and supplies ICchip 1004 supplied to rotary table 1075 within die hole 1078 oftabletting machine main body 1076. Rotary table 1075 is rotated by arotational force received from drive motor 1060. In the presentembodiment, it is controlled to rotate intermittently at 90 degreesintervals. Moreover, rotary table 1075 includes protruding parts 1075 bprotruding outward at 90 degrees intervals on an outer circumference ofplate-like main body 1075 a. IC chip receiving portion 1079 is providedat protruding parts 1075 b. From the side of supply apparatus 1003, ICchips 1004 are supplied in two-pieces unit. Therefore, two IC chipreceiving portions 1079 are provided for each protruding part 1075 b. Inthe present embodiment, a position rotated by 180 degrees from the ICchip receiving position from supply apparatus 1003 on an upstream sideis set to be a supplying position of IC chip 1004 to tabletting machinemain body 1076. Then, it is temporarily stopped at a position rotated by90 degrees from the IC chip receiving position. At this time, it isfavorable to provide, for example, an inspection apparatus forperforming an inspection on whether or not the IC ship is correctlysupplied to IC chip receiving portion 1059.

As shown in FIG. 32 by enlargement, a through-hole 1075 b′ penetratingup and down is provided at a specified position of protruding part 1075of rotary table 1075, and a positioning guide 1061 is mounted tothrough-hole 1075 b′. This positioning guide 1061 constitutes IC chipreceiving portion 1059. Positioning guide 1061 has a basic shape of aring shape having a through hole penetrating up and down as also shownin FIGS. 33A to 33C.

Positioning guide 1061 includes a flange portion radially protruding onan outer circumference of an upper circumferential side surface of acylindrical main body 1062, and a convex portion 1063 protruding upwardis provided at a center of an upper surface of main body 1062. Convexportion 1063 includes a flat surface 1063 a on its side surface. Convexportion 1063 is inserted to through-hole 1075 b′ of protruding part 1075b, and flange portion 1063 is sandwiched and held by protruding part1075 b and main body 1075 a. Accordingly, a movement in an axialdirection, in other words, an up/down direction of positioning guide1061 is prevented, so that separation of positioning guide 1061 fromrotary table 1075 is prevented. Further, an inner circumferentialsurface shape of through-hole 1075 b′ of protruding part 1075 b is setto substantially match with an outer peripheral surface shape of convexportion 1063 of positioning guide 1061. Accordingly, rotation about anaxis of positioning guide 1061 is prevented. Therefore, positioningguide 1061 is held at rotary table 1075 at a correct location and in acorrect manner.

A through-hole 1066 provided in positioning guide 1061 has a taperedsurface 1066 a in which a cross section of an upper region is circularand has a diameter gradually increasing as it goes upward. This upperregion is a region in which convex portion 1063 is mainly formed. Aninner diameter of through-hole 1066 at an upper end of convex portion1063 is set to be larger than an outer diameter of IC chip 1004, and ICchip 1004 suctioned and held by third suction nozzle portion 1073 entersthrough-hole 1066 of positioning guide 1061 in accordance with thelowering of third suction nozzle portion 1073. The entering is guided bytapered surface 1066 a to prompt a smooth downward movement.

Moreover, an inner circumferential surface in a portion of main body1062 of through-hole 1066 is provided with a plurality of protrusions1067 protruding toward a center. In the present embodiment, fiveprotrusions 1067 are provided. However, the number may be, for example,three, or any other number may be used. A leading end position ofprotrusion 1067 is positioned on an imaginary circumference beingconcentric with through-hole 1066 and having a predetermined diameter.This predetermined diameter is set to be equal to or slightly smallerthan a diameter of IC chip 1004. Accordingly, a peripheral edge of ICchip 1004 inserted to through-hole 1066 of positioning guide 1061 issupported by protrusions 1067, and IC chip 1004 is held in a state wherea center of IC chip 1004 and a center of positioning guide 1061(through-hole 1066) are matched. Therefore, positioning is performedwith a high accuracy. Moreover, it is preferable to manufacturepositioning guide 1061 with an elastic body such as rubber since itholds IC chip 1004 more firmly. Furthermore, protrusions 1067 arepreferably arranged at equal intervals in the circumferential direction.It is preferable since IC chip 1004 is evenly supported.

Further, in the present embodiment, a push-in portion 1064 protrudingdownward is provided on a lower surface of main body 1062. A planarshape of this push-in portion 1064 is set to be substantially ellipticalas shown in FIG. 33C. In this example, it has a shape of being collapsedflatly on both ends of a large-diameter side of the elliptical shape.The planar shape of push-in portion 1064 is based on a shape of a tabletto be manufactured, and is slightly smaller than that shape. In otherwords, it has a shape which is slightly smaller than a cross-sectionalshape of die hole 1078 formed in tabletting machine main body 1076.Moreover, push-in portion 1064 has a tapered shape 1064 a having aperipheral surface becoming smaller as it goes downward. Further, in thepresent embodiment, protrusions 1067 formed on an inner circumferentialsurface of through-hole 1066 is formed to a lower end of this push-inportion 1064.

Next, a supply of IC chip 1004 from supply apparatus 1003 to IC chipsupply apparatus 1074 and an operation of supplying IC chip 1004 totabletting machine 1002 will be described, and a configuration of ICchip supply apparatus 1074 will be described. FIGS. 34A and 35Arepresents a state in which a leading end of third suction nozzleportion 1073 of supply apparatus 1003 is inserted into positioning guide1061 constituting IC chip receiving portion 1059. As shown in thedrawings, second suction and hold member 1023 moves downward, and aleading end of third suction nozzle portion 1073 suctioning and holdingIC chip 1004 enters through-hole 1066 of positioning guide 1061, andstops at an appropriate position of main body 1062. At this appropriateposition, IC chip 1004 is supported by protrusions 1067. Since thesuction by third suction nozzle portion 1073 is performed until reachingthis stopping position, IC chip 1004 moves downward while maintaining ahorizontal state in a downward manner in which chip main body 1006 ispositioned below. At the lower stopping position of third suction nozzleportion 1073, IC chip 1004 comes into contact with the plurality ofprotrusions 1067 in a horizontal manner.

Next, the suction by third suction nozzle portion 1073 is released, andthird suction nozzle portion 1073 moves upward, separates apart frompositioning guide 1061, and proceeds to take next IC chip. On the otherhand, IC chip 1004 in a downward manner remaining in positioning guide1061 is supported in a state of maintaining a horizontal manner byprotrusions 1067 of positioning guide 1061. Moreover, theabove-described positioning of IC chip 1004 at a center is performedwith a high accuracy.

The drawings subsequent to FIGS. 34B and 35B represent a supply positionto tabletting machine 1002 with rotary table 1075 rotated by 180 degreesfrom the state of FIGS. 34A and 35A. At this supply position, twopushers 1082 are suspended on the leading end lower surface of anL-shaped plate 1081 which receives driving of first cylinder 1080 andmoves upward and downward. Two pushers 1082 are in conformity with anarrangement pitch of two positioning guides 1061 adjacent to each otherin a circumferential direction, and are adjusted so that an axis centerof each positioning guide 1061 and an axis center of pusher 1082 matchesat the time when the rotary table is temporarily stopped.

Further, first cylinder 1080, L-shaped plate 1081, pushers 1082, androtary table 1075 can be lifted and lowered integrally. Then, thelifting and lowering operation is performed by receiving driving ofsecond cylinder 1083.

Therefore, positions of rotary table 1075 and pushers 1082 can beswitched by appropriately switching the reciprocating operation of firstcylinder 1080 and second cylinder 1083. For example, FIGS. 34B and 35Brepresent a state in which first cylinder 1080, L-shaped plate 1081,pushers 1082, and rotary table 1075 are positioned at a lifted positionby second cylinder 1083, and pushers 1082 are also positioned at alifted position by first cylinder 1080. In this state, rotary table 1075is separated apart from an upper surface of rotating table 1077 oftabletting machine main body 1076, and positioning guide 1061 is alsoseparated apart from an upper surface of rotating plate 1077. Moreover,a lower surface of pusher 1082 is positioned above positioning guide1061, and pushers 1082 and IC chip 1004 supported by positioning guide1061 in a downward manner are in a non-contact state. This state is aninitial state when rotary table 1075 is rotated to reach a supplyingposition and temporarily stopped.

Next, only second cylinder 1083 is operated to position first cylinder1080, L-shaped plate 1081, pushers 1082, and rotary table 1075 at alowered position. Accordingly, as shown in FIGS. 34C and 35C, rotarytable 1075 comes close to an upper surface of rotating plate 1077 oftabletting machine main body 1076, and a lower surface of main body 1062of positioning guide 1061 comes into contact with an upper surface ofrotating plate 1077. Further, push-in portion 1064 enters die hole 1078,and comes into contact with pharmaceutical powder filled in die hole1078. Moreover, at this time, since first cylinder 1080 remains in theinitial state, a relative positional relationship between pusher 1082and positioning guide 1061 does not change, and a lower surface ofpusher 1082 is positioned above positioning guide 1061, and pushers 1082and IC chip 1004 in a downward manner supported by positioning guide1061 are in a non-contact state.

After that, while second cylinder 1083 maintains the above-describedstate, first cylinder 1080 is operated, and pushers 1082 are moveddownward. Accordingly, as shown in FIGS. 34D and 35D, a lower end ofpusher 1082 reaches a lower end of positioning guide 1061, in otherwords, to a lower end of push-in portion 1064, and IC chip 1004 isforced downward by pusher 1082, pushed out from positioning guide 1061,and pushed into pharmaceutical powder 1090. Also during the downwardmovement of IC chip 1004 by pusher 1082, IC chip 1004 moves whilemaintaining a horizontal state and a center position by means ofprotrusions 1067 of positioning guide 1061. Therefore, when IC chip 1004is pushed out from positioning guide 1061 and finally pushed into andsupplied to pharmaceutical powder 1090, it is supplied with a highaccuracy to a center of a surface of pharmaceutical powder 1090 filledin die hole 1078. Moreover, since IC chip 1004 is pushed by pusher 1082into pharmaceutical powder 1090 before being compressed by tablettingmachine main body, a positional displacement is suppressed.

Further, since IC chip 1004 is pushed into pharmaceutical powder 1090 ina downward manner in which chip main body 1006 is positioned below, chipmain body 1006 is further inserted into pharmaceutical powder 1090 withrespect to a surface of pharmaceutical powder 1090 in contact with basefilm 1005 for example. Therefore, even when IC chip 1004 attempts tomove in a horizontal direction, chip main body 1006 serves like a wedge,so that a positional displacement due to a lateral movement can besuppressed assuredly.

Further, in the present embodiment, as described above, a horizontalstate and a positioning at a center is performed with a high accuracy byprotrusions 1067 of positioning guide 1061. Thus, since it can besupplied to a center of pharmaceutical powder 1090 assuredly,positioning is secured without performing, after the supply, aninspection on whether or not it is supplied to a correct position.Therefore, even in the case where an inspection apparatus is provided,it may be a simple sensor for confirming presence of a supply, and anapparatus for which a space region for installation cannot be securedmay be used.

FIGS. 36A to 39C represent an operation of tabletting machine main body1005. As shown in FIG. 36A, a lower pestle 1092 is fitted to a lowerside of die hole 1078 from a lower side slidably upward and downward. Asshown in FIG. 39A, an upper pestle 1093 is provided on an upper side ofdie hole 1078 movably upward and downward. As shown in FIG. 36A,firstly, pharmaceutical powder 1090 is filled into die hole 1078 bypharmaceutical powder filling apparatus in a state where lower pestle1092 is at a lowered position within die hole 1078. Next, lower pestle1092 is lifted, and a supply by pharmaceutical powder filling apparatus1094 is cut, and a certain amount of pharmaceutical powder 1090 isfilled into a space of die hole 1078 formed on an upper side of lowerpestle 1092 in a leveled state (FIG. 36B). After that, lower pestle 1092is lowered by a predetermined amount, so that a surface ofpharmaceutical powder 1090 is slightly lowered from an upper surface ofrotating plate 1075 (FIG. 37A).

In this state, by means of IC chip supply apparatus 1074 describedabove, positioning guide 1061 having IC chip 1004 in a downward mannerset therein enters die hole 1078 (FIG. 37B), and IC chip 1004 is pushedout and pushed into pharmaceutical powder 1090 by pusher 1082 (FIG.37C).

Next, rotating plate 1075 rotates to allow the die hole positioned atthe supply position to proceed to the next step (FIG. 38A). In a statewhere lower pestle 1092 is lowered within die hole 1078, pharmaceuticalpowder 1090 is filled in die hole 1078 by pharmaceutical powder fillingapparatus 1094 (FIG. 38B). Next, lower pestle 1092 is lifted, and asupply by pharmaceutical powder filling apparatus 1094 is cut, and aspace of die hole 1078 formed on an upper side of lower pestle 1092 isfilled with a certain amount of pharmaceutical powder 1090 in a leveledstate (FIG. 38C).

Next, upper pestle 1093 moves downward and compresses pharmaceuticalpowder 1090 between upper pestle 1093 and lower pestle 1092 (FIG. 39A).Accordingly, pharmaceutical powder 1090 is solidified, so that an ICchip-containing tablet 1095 is manufactured (FIG. 39B). After that,lower pestle 1092 further moves upward to discharge manufactured tablet1095.

<Modified Example>

Push-in portion 1064 is not always necessary. Without providing push-inportion 1064, IC chip 1004 may be pushed with a pusher in a state wherea lower surface of main body 1062 is in contact with an upper surface ofrotating plate 1075. In this case, pharmaceutical powder within the diehole may be filled to an upper end of the die hole to be a leveledstate.

Moreover, when push-in portion 1064 is provided as in theabove-described embodiment, push-in portion 1064 may enter die hole 1078and further push the pharmaceutical powder filled in die hole 1078.Accordingly, a recess having an inner shape matching with an outer shapeof push-in portion 1064 is formed on a surface of pharmaceutical powder.Therefore, since IC ship 1004 is set within the recess, the positionaldisplacement due to the lateral movement can be suppressed assuredly.

Even in the case where protrusions are provided, it may be omitted at alower end rather than forming it to a lower end of positioning guide1061. In such a case, for example, protrusions may be formed only at themain body portion, and protrusions may be omitted at whole or a part ofthe portion corresponding to the push-in portion.

It should be noted that, in the above-described embodiment, althoughpositioning guide 1061 including protrusions 1067 on the innercircumferential surface is provided, and IC chip 1004 set withinpositioning guide 1061 is pushed by the pusher, the present invention isnot limited to this. For example, a positioning guide withoutprotrusions may be used. Moreover, suction means may be used in place ofthe pusher to push an IC chip suction by the suction means into thepharmaceutical powder within the die hole.

Moreover, although the IC chip is supplied to the pharmaceutical powderin a downward manner in the above-described embodiment, it may besupplied in an upward manner.

Although IC chip 1004 is accommodated in accommodation tape 1007, andfirst suction and hold member 1022 takes out the IC chip from theaccommodation tape in the above-described embodiment, the presentinvention is not limited to this. For example, IC chips 1004 may bealigned by, for example, a parts feeder or the like.

<Modified Example of Guide Member>

In the above-described embodiment, an example is described in which afixed cylindrical guide 1040 is used as an item constituting a guidemember. However, the present invention is not limited to this. Forexample, it may include a plurality of moving guide members, and a drivemechanism for allowing the moving guide member to come close to andseparate from each other, and the plurality of moving guide members maycome close to each other to form a through-hole. For example, as shownin FIGS. 40A and 40B, guide member 1098 is configured to allow twomoving guide member 1096 to cooperate with cylinders 1097 as respectivedrive sources and come close to and separate from each other.

Moreover, at a leading end of moving guide member 1096, flat parts 1096a on both sides and recesses 1096 b near a center are formed. As shownin FIG. 40A, in a state where two moving guide members 1096 receive adriving force of cylinder 1097 and are separated apart, a space betweenleading ends is widened. First suction nozzle portion 1022 b of firstsuction and hold member 1022 enters the space. Next, when moving guidemembers 1096 are moved to come close to each other, flat parts 1096 acome into contact with each other, and a through-hole is formed betweenrecesses 1096 b. First suction nozzle portion 1022 b is controlled so asto be positioned within the through-hole. Moreover, the second suctionnozzle portion is also positioned within this through-hole at anappropriate timing and holds IC chip 1004 suctioned and held by firstsuction nozzle portion 1022 b.

Then, even in the case where a center of IC chip 1004 is displaced froma center of first suction nozzle portion 1022 b when first suctionmember 1022 takes out IC chip 1004 from accommodation tape 1007, ifmoving guide member 1096 is moved com close in a state where firstsuction and hold member 1022 (first suction nozzle portion 1022 b) ispositioned between moving guide member 1096 at a position of receivingIC chip 1004, recess 1096 b come into contact with a side surface of ICchip 1004, so that IC chip 1004 is moved in the horizontal direction toa center of first suction nozzle portion 1022 b, so that positioning canbe performed. It should be noted that inner shape dimensions of thethrough-hole formed by moving guide member 1096 coming close are greaterthan the outer shape dimensions of IC chip 1004, and IC chip 1004 is notsandwiched and gripped within recessed groove 1096 b when both movingguide members 1096 come close to each other, and a smooth transfer fromfirst suction nozzle portion 1022 b to second suction nozzle portion1023 c is performed.

Further, moving guide members 1096 may be moved to come close to eachother after first suction nozzle portion 1022 b and second suctionnozzle portion 1023 b face and come close to each other. In this manner,the IC chip can be passed assuredly in a state of being surrounded bythe first nozzle portion, the second nozzle portion, and the movingguide surface.

FIG. 41 is a front view representing a favorable one embodiment of atablet manufacturing apparatus according to the present invention. FIGS.42 and 43 are plan views thereof. FIGS. 44A to 44C are diagrams forexplaining an IC chip to be supplied in the present embodiment. FIGS.44A to 44C and subsequent drawings are enlarged views of each portion ofan apparatus and an effect thereof.

As shown in FIGS. 41 to 43, a tablet manufacturing apparatus of thepresent embodiment includes a tabletting machine 2002 and a supplyapparatus 2003 for conveying and supplying an IC chip to tablettingmachine 2002. IC chip 2004 conveyed and supplied in the presentembodiment has a formed in which a chip main body 2006 is mounted at acenter position of a circular base film 2005 as shown in FIGS. 44A to44C. Base film 2005 has a disk-like outer diameter having a diameter of,for example, 3.5 mm, and has, for example, a function of supporting chipmain body 2006 and an antenna function of communicating information withoutside. Chip main body 2006 has a rectangular outer shape of, forexample, 1 mm square, and an electronic circuit is incorporated inside.Chip main body 2006 includes, for example, a storage portion storinginformation for specifying a tablet into which IC chip 2004 is buried,and a function for transmitting the information stored in the storageportion at a predetermined timing.

IC chip 2004 s having the above-described configuration, as shown inFIGS. 44A and 44B, are accommodated in line at predetermined intervalsin a belt-like accommodation tape 2007. Accommodation tape 2007 includesa carrier tape 2008 having accommodation recesses 2008 a formed atpredetermined intervals, and a top tape 2009 covering an upper surfaceof carrier tape 2008. IC chip 2004 is accommodated in accommodationrecess 2008 a. In FIG. 44B, as illustrated on the right side, top tape2009 is peeled off from carrier tape 2008 to open an upper side ofaccommodation recess 2008 a, so that accommodated IC chip 2004 can betaken out. IC chip 2004 is accommodated in accommodation recess 2008 ain a state of being in an upward manner where chip main body 2006 ispositioned on an upper side. Further, accommodation tape 2007 has feedholes 2007 a formed at even pitches along one side edge. Thisaccommodation tape 2007 is taken up by a supply reel 2010.

Supply apparatus 2003 includes, on it front face, a rotary support shaft2011 freely rotatably bearing-supporting supply reel 2010 configured totake up the above-described accommodation tape 2007 in a rolled form,and supply reel 2010 is set on rotary support shaft 2011. Supplyapparatus 2003 includes, on its front face, various rollers 2012 fordefining conveying routes of accommodation tape 2007 and separatedcarrier tape 2008 and top tape 2009, accommodation tape opening portion2013 peeling off top tape 2009 from carrier tape 2008 to enable takingout IC chip 2004 accommodated in accommodation tape 2007, a carrier tapecollecting portion 2014 for collecting carrier tape 2008 after IC chip2004 is taken out, and a top tape collecting portion 2015 for collectingtop tape 2009.

Accommodation tape opening portion 2013 includes a guide plate 2017constituting a conveying passage arranged in a horizontal direction onan upper predetermined position, a pair of sprockets 2018 arranged on afront side and back side in a conveying direction of accommodation tape2007 of guide plate 2017, and a peeling plate 2019 arranged on an upperpredetermined position of guide plate 2017.

Guide plate 2017, as shown in FIGS. 45A to 45C by enlargement, has arecessed groove 2017 a extending in an axial direction on an uppersurface. A width of recessed groove 2017 a is set to be equal to orslightly larger than a tape width of accommodation tape 2007. Therefore,accommodation tape 2007 passes within recessed groove 2017 a to moveforward stably without a positional displacement. Further, as shown inFIGS. 45A to 45C and FIG. 46, in a portion on an upstream side of guideplate 2017, a slit 2017 b is formed on a bottom portion of recessedgroove 2017 a, and slit 2017 b communicates with a connection pipe 2017c mounted to a lower surface of guide plate 2017. Connection pipe 2017 ccooperates with an unillustrated suction pump. Accordingly, a parthaving an opened slit 2017 b on a bottom surface of recessed groove 2017a generates a negative pressure to suction accommodation tape 2007, sothat a stable conveyance can be performed.

Moreover, sprockets 2018 have protrusions 2018 a on its circumferentialsurface at predetermined pitches. When accommodation tape 2007 is passedon sprocket 2018, protrusions 2018 a penetrate through feed holes 2007 aof accommodation tape 2007 to protrude upward from accommodation tape2007. Accordingly, when sprockets 2018 are rotated, protrusions 2018 awithin feed holes 2007 a give a conveying force to accommodation tape2007, so that accommodation tape 2007 follows it and moves forward by apredetermined quantity. When sprockets 2018 are stopped, the forwardmovement of accommodation tape 2007 is also stopped. Sprocket 2018cooperates with an unillustrated drive motor such as a servo motorcapable of controlling a rotational angle, and an intermittent operationis controlled at a predetermined timing.

Peeling plate 2019, as schematically illustrated in FIG. 44B, includes areference surface 2019 a arranged in parallel with a conveyance surfaceof accommodation tape 2007, and a slope surface 2019 b sloped diagonallybackward from reference surface 2019 a. Accommodation tape 2007 passesthrough sprocket 2018 on an upstream side and thereafter passes througha position between guide plate 2017 and peeling plate 2019, and top tape2009 is folded back by slope surface 2019 b from reference surface 2019a of peeling plate 2019 and peeled off from carrier tape 2008.Accordingly, carrier tape 2008 is opened on an upper side ofaccommodation recess 2008 a. Then, carrier tape 2008 is guided by guideplate 2017 and moves horizontally.

It should be noted that carrier tape 2008 passes through accommodationtape opening portion 2013 and thereafter passes through a predeterminedpassage to reach carrier tape collecting portion 2014 and is taken upand collected by a take-up reel. Similarly, peeled top tape 2009 alsopasses through a predetermined passage to reach top tape collectingportion 2015, and is taken up and collected by a take-up real andcollected.

On an upper side of accommodation tape opening portion 2013, a IC chiptake-out apparatus 2020 is provided. This IC chip take-out apparatus2020 has a function of taking out IC chip 2004 accommodated withinopened accommodation tape 2007, reversing an manner upside down, andpassing IC chip 2004 to conveying apparatus 2021 in a next stage. In thepresent embodiment, two front and back IC chips 2004 accommodated inaccommodation tape 2007 are taken out collectively. Therefore, sprockets2018 and the like are operated to intermittently convey accommodationtape 2007 at intervals of two IC chips 2004 and controlled totemporarily stopped in a state where IC chip 2004 is positioned at atake-out position of IC chip take-out apparatus 2020.

Then, IC chip take-out apparatus 2020 includes a first suction and holdmember 2022 for taking out IC chip 2004 accommodated in accommodationtape 2007 and reversing IC chip 2004 upside down, and a second suctionand hold member 2023 for receiving IC chip 2004 taken out and reversedby first suction and hold member 2022 and supplying IC chip 2004 toconveying apparatus 2021.

First suction and hold member 2022 has two first suction nozzle portions2022 b formed to protrude on a leading end of main body 2022 a having anelongated belt-like shape. An arrangement interval of two first suctionnozzle portion 2022 b matches with an arrangement pitch of IC chip 2004in accommodation tape 2007. A leading end of first suction nozzleportion 2022 b is opened, and the opening part communicates with asuction passage 2022 c formed within main body 2022 a and first suctionnozzle portion 2022 b and is connected to an unillustrated suction pump.

Moreover, this first suction and hold member 2022 is configured to moveupward and downward and be rotated within a vertical plane. Asillustrated in FIGS. 45A to 45C by enlargement, first suction and holdmember 2022 is bearing-supported through bearing 2028 with respect tomoving plate 2026 moving upward and downward, and moves upward anddownward with moving plate 2026. On a back side of moving plate 2026,sliders 2024 are attached which are mounted to be moved upward anddownward with respect to two guide rails 2025 extending upward anddownward. Moving plate 2026 stably moves upward and downward while beingguided by guide rails 2025 and sliders 2024. A drive mechanism formoving this moving plate 2026 upward and downward is configured tocouple one end of belt-like coupling plate 2031 to an eccentric positionof rotating plate 2030 which is rotated by a rotational force receivedfrom drive motor 2033 and couple the other end of coupling plate 2031 tomoving plate 2026. Accordingly, rotation of rotating plate 2030 causescoupling plate 2031 and moving plate 2026 to move upward and downward.Then, moving plate 2026 reciprocates between a lifted position shown inFIGS. 41 and 45A to 45C and a lowered position shown in FIG. 46.

Moreover, on a back side of moving plate 2026, a drive motor 2032 isattached which is a drive source for rotating first suction and holdmember 2022, and drive motor 2032 also moves upward and downwardintegrally with moving plate 2026. Rotational shaft 2034 cooperatingwith an output shaft of drive motor 2032 is mounted to a bearing 2028arranged to protrude on a front face side of moving plate 2026, andfirst suction and hold member 2022 is fixed to a leading end ofrotational shaft 2034. Accordingly, rotation of drive motor 2032 causesfirst suction and hold member 2022 to rotate. Then, first suction andhold member 2022 temporarily stops its rotation in two manners of apassing manner having a leading end facing upward as shown in FIGS. 41and 45A to 45C and a take-out manner having a leading end facingdownward as shown in FIG. 46.

Accordingly, when drive motors 2032, 2033 are appropriately controlledto move first suction and hold member 2022 downward in a state of beingin a take-out manner of facing downward, a leading end of first suctionnozzle portion 2022 b comes into contact with IC chip 2004 withinaccommodation tape 2007 (FIGS. 46, 47A, and 48A). When first suctionnozzle portion 2022 b communicates with an unillustrated suction pump inthis state, suction by first suction nozzle portion 2022 b is performed,so that first suction nozzle portion 2022 b suctions and holds IC chip2004.

Next, when moving plate 2026 is moved upward while maintaining firstsuction and hold member 2022 to be in the downward take-out manner,first suction nozzle portion 2022 b of first suction and hold member2022 is positioned above accommodation tape 2007 in a state ofsuctioning and holding IC chip 2004. Accordingly, taking out IC chip2004 from accommodation tape 2007 is completed. Then, moving plate 2026and first suction and hold member 2022 further moves upward to reach alifted position. Before reaching the lifted position, first suction andhold member 2022 receives driving of drive motor 2032 and rotates by 180degrees to shift to a passing manner of facing upward. Accordingly, ICchip 2004 suctioned by first suction nozzle portion 2022 b of firstsuction and hold member 2022 is reversed upside down to be at a flatposition in which chip main body 2006 is positioned on a lower side ofbase film 2005.

As shown in FIGS. 45A to 45C and 47B, a cylindrical guide 2040 isarranged at a position where first suction nozzle portion 2022 b offirst suction and hold member 2022 when first suction and hold member2022 is at a lifted position in a passing manner of facing upward. Thiscylindrical guide 2040 is coupled to a machine frame through a supportplate 2048 and the like extending in a horizontal direction and fixedlyarranged at a desired position. Cylindrical guide 2040 includes twothrough-holes 2041 extending upward and downward. Two through-holes 2041have parallel axes, and a pitch between axes is matched with anarrangement pitch of first suction nozzle portion 2022 b. Moreover, eachthrough-hole 2041 includes a inlet region 2041 a at a lower end, acenter region 2041 b, and an outlet region 2041 c at an upper end. Innerdiameter dimensions of inlet region 2041 a and outlet region 2041 c areset to be enough larger than outer shape dimensions of IC chip 2004, andinner shape dimensions of center region 2041 b are set to besubstantially equal to or greater than outer shape dimensions of IC chip2004. Further, the inner circumferential surface of center region 2041 bis set to be a tapered surface having a narrowest center in the up/downdirection. Then, when first suction and hold member 2022 moves upwardwhile maintaining a passing manner of facing upward, first suctionnozzle portion 2022 b enters inlet region 2041 a from a lower end ofcylindrical guide 2040. After having reached the lifted position, aleading end of first suction nozzle portion 2022 b is positioned withincenter region 2041 b. More specifically, it is positioned near anarrowest center position within center region 2041 b. Accordingly, theentering of IC chip 2004 suctioned and held by first suction nozzleportion 2022 b into cylindrical guide 2040 passes through inlet region2040 a having a relatively large size, and moves within center region2041 b having a gradually reduced inner diameter, so that it can movesmoothly to a lifted position.

On the other hand, second suction and hold member 2023 includes a firstmain body 2023 a and a second main body 2023 b which come closest to andseparate from each other in a horizontal direction. Second suctionnozzle portions 2023 c are provided respectively at leading ends offirst and second main bodies 2023 a, 2023 b. An arrangement interval oftwo second suction nozzle portions 2023 c in the state where first mainbody 2023 a and second main body 2023 b come close to each other is setto match with an arrangement interval of first suction nozzle portion2022 b of first suction and hold member 2022. Further, a leading end ofsecond suction nozzle portion 2023 c is opened, and the opened partcommunicates with suction passage 2023 d formed within first and secondmain bodies 2023 a, 2023 b and second suction nozzle portions 2023 c,and are connected to an unillustrated suction pump.

Moreover, this second suction and hold member 2023 is configured to movewithin a three dimensional space. This movement is performed by a firstrobot 2049. In other words, first robot 2049 includes an arm 2044 of aSCARA robot moving in a horizontal plane, a support rod 2043 attached tobe movable in an upward and downward directions to a leading end lowersurface of arm 2044, and a base 2042 attached to a lower end of supportrod 2043. By the horizontal movement of arm 2044 of the SCARA robot andthe upward and downward movement of support rod 2043, base 2042 can bemoved to a desired position within a three dimensional space. Then,first main body 2023 a and second main body 2023 b constituting secondsuction and hold member 2023 are movably attached through sliders 2023 eto guide rails 2042 a provided at a lower surface of base 2042. Themovement of first main body 2023 a and second main body 2023 b isperformed for example by cylinder driving. Accordingly, base 2042 andsecond suction and hold member 2023 supported on the lower surface ofbase 2042 move within the three dimensional space. Further, first mainbody 2023 a and second main body 2023 b come close to and separate fromeach other along guide rails 2042 a.

Specifically, second suction and hold member 2023 moves to a position ofoverlapping with cylindrical guide 2040 within the horizontal plane inaccordance with the operation of arm 2044 of the SCARA robot, andsupport rod 2043 moves downward while maintaining that state, so thatsecond suction and hold member 2023 reaches a lowered position. At thistime, first main body 2023 a and second main body 2023 b are in a stateof being close to each other. In this state, as shown in FIGS. 45A to45C, 47B, and 48B, second suction nozzle portion 2023 c enters outletregion 2041 c from an upper end of cylindrical guide 2040. Then, afterreaching a lowermost end position, a leading end of second suctionnozzle portion 2023 c is positioned within center region 2041 b. In thisstate, it is controlled to come close with a certain clearance (forexample, about 0.5 mm) to a leading end of first suction nozzle portion2022 b of first suction and hold member 2022 positioned at a liftedposition. Accordingly, IC chip 2004 suctioned and held by first suctionnozzle portion 2022 b waits in a state of being positioned in centerregion 2041 b of through-hole 2041 of cylindrical guide 2040, and alower end of second suction nozzle portion 2023 c of second suction andhold member 2023 entered into cylindrical guide 2040 from above comesinto contact with or close to IC chip 2004. Then, suction by secondsuction nozzle portion 2023 c is started, and suction by first suctionnozzle portion 2022 b is stopped at an appropriate timing, so thatsuctioning and holding of IC chip 2004 is shifted to the side of secondsuction and hold member 2023.

As can be seen, the present embodiment is characterized in performing atransfer of IC chip 2004 from first suction and hold member 2022 tosecond suction and hold member 2023 within cylindrical guide 2040. SinceIC chip 2004 has, for example, a small diameter of 3.5 mm and has a thinshape of base film 2005, holding with the suction and hold member cannotbe performed firmly. Therefore, when passing from first suction and holdmember 2022 to second suction and hold member 2023 is performed in astate where IC chip 2004 is exposed, there is a likelihood that thepassing cannot be performed smoothly and IC chip 2004 is dropped.However, in the present embodiment, since the passing process isperformed inside of cylindrical guide 2040, the passing can be performedassuredly.

After that, first suction and hold member 2022 moves downward whilemaintaining the passing manner. When first suction nozzle portion 2022 bgoes out of cylindrical guide 2040, it rotates by 180 degrees, takes atake-out manner, and returns to a lowered position at an appropriatetiming, and prepares for the next operation of taking out the IC chip.On the other hand, second suction and hold member 2023 having receivedIC chip 2004 moves upward along with the lifting of support rod 2043,and second suction nozzle portion 2023 c is positioned on an upper sideof cylindrical guide 2040. After that, second suction and hold member2023 is moved in a horizontal direction by the operation of arm 2044 ofthe SCARA robot to reach the conveying-in position of conveyingapparatus 2021.

Conveying apparatus 2021, as shown in FIGS. 49A to 49B, includes a firstreceiving portion 2045 and a second receiving portion 2046 for receivingtwo IC chips 2004 suctioned and held and conveyed by second suction andhold member 2023, and a drive mechanism 2047 for moving first receivingportion 2045 and second receiving portion 2046 forward and backward. Asshown in FIGS. 50A and 50B by enlargement, first receiving portion 2045includes, on an upper surface of two pillar portions 2045 a separatedinto two legs facing upward, a recess 2045 b accommodating IC chip 2004.An interval of pillar portions 2045 a (recesses 2045 b) is inconformitywith the tabletting machine in the next stage, and is set to be longerthan an arrangement pitch of IC chips 2004 in accommodation tape 2007(an arrangement interval of first suction nozzle portion 2022 b andsecond suction and hold member 2023). Moreover, a bottom surface ofrecess 2045 b communicates with suction passage 2045 c formed withinpillar portion 2045 a and is connected to an unillustrated suction pump.Accordingly, IC chip 2004 set within recess 2045 b is suctioned and heldwithin recess 2045 b. Even when first receiving portion 2045 movesforward, IC chip 2004 moves forward with first receiving portion 2045while being set within recess 2045 b.

Similarly, second receiving portion 2046 includes, on an upper surfaceof two pillar portions 2046 a separated into two legs facing upward,recess 2046 b for accommodating IC chip 2004. An interval of pillarportions 2046 a (recesses 2046 b) is in conformity with a tablettingmachine in the next stage, and is set to be longer than an arrangementpitch of IC chips 2004 in accommodation tape 2007 (an arrangementinterval of first suction nozzle portion 2022 b and second suction andhold member 2023). Moreover, a bottom surface of recess 2046 bcommunicates with suction passage 2046 c formed within pillar portion2046 a and is connected to an unillustrated suction pump. Accordingly,IC chip 2004 set within recess 2046 b is suctioned and held withinrecess 2046 b. Even when second receiving portion 2046 moves forward, ICchip 2004 moves forward with second receiving portion 2046 while beingset within recess 2046 b.

A drive mechanism 2047 for first receiving portion 2045 and secondreceiving portion 2046 includes a drive motor 2050, and a rack 2051 anda pinion 2052 which receive an output of drive motor 2050 and convertsit into a reciprocating linear motion. First receiving portion 2045 andsecond receiving portion 2046 cooperate with corresponding rack 2051respectively through coupling plates 2053, 2054 and move in a reversedirection. In other words, when first receiving portion 2045 movesforward, second receiving portion 2046 moves backward. When firstreceiving portion 2045 moves forward, second receiving portion 2046moves backward. In other words, for example, when first receivingportion 2045 is at a conveying-in position, second receiving portion2046 is at a conveying-out position. Moreover, for example, when firstreceiving portion 2045 is at a conveying-out position, second receivingportion 2046 is at a conveying-in position. Moreover, sliders 2055 arecoupled to a lower surface of coupling plate 2053 and an upper surfaceof coupling plate 2054. Sliders 2055 are mounted respectively tocorresponding guide rails 2056 and guides forward and backward movementof rack 2051 and each of receiving portions 2045, 2046 along withrotation of pinion 2052.

Second suction and hold member 2023 having received IC chip 2004 moveswithin a horizontal plane by means of arm 2044 of the SCARA robot, andis positioned above first receiving portion 2045 or second receivingportion 2046 positioned at a conveying-in position. As described above,since first receiving portion 2045 and second receiving portion 2046move forward and backward in reverse directions with each other, firstrobot 2049 controls an operation of arm 2044 of the SCARA robot toposition second suction and hold member 2023 alternately above theconveying-in position of first receiving portion 2045 and above theconveying-in position of second receiving portion 2046.

As described above, since intervals of pillar portions 2045 (recesses2045 b) of first receiving portion 2045 and pillar portions 2046 a(recesses 2046 b) of second receiving portion 2046 are widened, firstrobot 2049 performs a control of separating first main body 2023 a andsecond main body 2023 b of second suction and hold member 2023 eachother and widening an interval of second suction nozzle portions 2023 cduring the horizontal movement of second suction and hold member 2023 byarm 2044 of the SCARA robot or at the time of being positioned above theconveying-in position. This widened interval of second suction nozzleportion 2023 c is set to be equal to an interval of recesses 2045 b,2046 b.

Then, when support rod 2043 is moved downward in a state where firstmain body 2023 a and second main body 2023 b are separated from eachother, as shown in FIG. 50A, a lower end of second suction nozzleportion 2023 c of second suction and hold member 2023 enters into recess2045 b of first receiving portion 2045, so that IC chip 2004 suctionedand held in a downward manner is set within recess 2045 b. Then, whensuction on the side of second suction and hold member 2023 is releasedat an appropriate timing, IC chip 2004 is transferred to recess 2045 bof first receiving portion 2045. Moreover, first receiving portion 2045starts suction in advance or at an appropriate timing to suction andhold IC chip 2004 within recess 2045 b.

Second suction and hold member 2023 having completed a supply of IC chip2004 to first receiving portion 2045 returns to a passing positionwithin cylindrical guide 2040 by an operation of first robot 2049 andsupplies a next passed IC chip to recess 2046 b of second receivingportion 2046.

On the other hand, first receiving portion 2045 having received a supplyof IC chip 2004 moves forward and is positioned at a conveying-outposition. IC chip 2004 within recess 2045 b of first receiving portion2045 having reached the conveying-out position is suctioned and held bya second robot 2070, and transferred to tabletting machine 2002. Secondrobot 2070 includes an arm 2071 of the SCARA robot moving within thehorizontal plane, a support member 2072 attached movably upward anddownward on a leading end lower surface of arm 2071, and a pair of thirdsuction nozzle portions 2073 attached to a lower end of support member2072.

A leading end of third suction nozzle portions 2073 is opened, and theopened part communicates with suction passages 2073 a formed withinthird suction nozzle portion 2073 and is connected to an unillustratedsuction pump. Then, by the horizontal movement of arm 2071 of the SCARArobot and the upward and downward movement of support member 2072, thirdsuction nozzle portions 2073 can move to a desired position within thethree dimensional space. Further, an interval of the pair of thirdsuction nozzle portions 2073 is in conformity with arrangement intervalsof pillar portions 2045 a (recesses 2045 b 9 of first receiving portion2045 and pillar portions 2046 a (recesses 2046 b) of second receivingportion 2046.

Accordingly, suction by the suction pump is performed when the lower endof third suction nozzle portions 2073 has reached recess 2045 b of firstreceiving portion 2045 or recess 2046 b of second receiving portion 2046at the conveying-out position by the operation of second robot 2070.When the suction by the vacuum pump on the side of first receivingportion 2045 or second receiving portion 2046 is released, IC chip 2004is suctioned and held on the side of third suction nozzle portion 2073(refer to FIG. 50B).

Next, when third suction nozzle portion 2073 suctioning and holding ICchip 2004 moves upward, horizontally, and downward by the operation ofsecond robot 2070, as shown in FIGS. 42 and 51B, it is positioned withinIC chip receiving portion 2079 of rotary table 2075 of IC chip supplyapparatus 2074 arranged on a conveying-in side of tabletting machine2002. When the suction by third suction nozzle portion 2073 is releasedin this state, IC chip 2004 is supplied to IC chip receiving portion2079.

Tabletting machine 2002 includes IC chip supply apparatus 2074 describedabove and a tabletting machine main body 2076. Tabletting machine mainbody 2076 is similar to a conventionally existing tabletting machine,and it fills pharmaceutical powder into a plurality of die holes 2078provided at predetermined intervals on a circumference along an outeredge portion of rotating plate 2077, and compresses and shapes thefilled pharmaceutical powder with a lower pestle and an upper pestle tomanufacture a tablet. In the present embodiment, in order to manufacturean IC chip-containing tablet, a function of firstly supplying IC chip2004 by means of IC chip supply apparatus 2074 onto a predeterminedamount of pharmaceutical powder supplied into die hole 2078, furtherfiling pharmaceutical powder onto IC chip 2004, and compressing andshaping these pharmaceutical powder and the IC chip from above and belowis provided. Details of the manufacturing processes for a tablet will bedescribed later.

IC chip supply apparatus 2074 as a main part of the present inventionincludes rotary table 2075 described above, and supplies and aligns ICchips 2004 supplied to rotary table 2075 within die holes 2078 oftabletting machine main body 2076. Rotary table 2075 is rotated by arotational force received from drive motor 2060. In the presentembodiment, it is controlled to rotate intermittently at 90 degreesintervals. Moreover, rotary table 2075 includes protruding parts 2075 bprotruding outward on an outer circumference of plate-like main body2075 a at 90 degrees intervals. An IC chip receiving portion 2079 isprovided at this protruding part 2075 b. Since IC chips 2004 aresupplied in two-pieces unit from the side of supply apparatus 2003, twoIC chip receiving portions 2079 are provided at each protruding part2075 b. In the present embodiment, a position rotated by 180 degreesfrom supply apparatus 2003 on an upstream side is a position ofsupplying IC chip 2004 to tabletting machine main body 2076. Then, it istemporarily stopped at a position rotated by 90 degrees from the IC chipreceiving position. However, at this time, it is favorable to provide,for example, an inspection apparatus for performing an inspection onwhether or not an IC chip is correctly supplied to IC chip receivingportion 2059.

As shown in FIG. 52 by enlargement, through-hole 2075 b′ penetrating upand down at a specified position of protruding part 2075 b of rotarytable 2075 is provided, and positioning guide 2061 is mounted tothrough-hole 2075 b′. This positioning guide 2061 constitutes IC chipreceiving portion 2059. As shown in FIGS. 53A to 53C, positioning guide2061 has a ring-like basic shape having a through-hole penetrating upand down.

Positioning guide 2061 includes a flange portion 2065 protrudingradially outward on an upper circumferential side surface of acylindrical main body 2062, and a convex portion 2063 protruding upwardis provided at a center of an upper surface of main body 2062. Convexportion 2063 includes on its side surface a flat surface 2063 a. Convexportion 2063 is inserted into through-hole 2075 b′ of protruding part2075 b, and flange portion 2065 is sandwiched and held by protrudingpart 2075 b and main body 2075 a. Accordingly, movement of positioningguide 2061 in an axial direction, in other words, an up/down directionis suppressed, so that separation of positioning guide 2061 from rotarytable 2075 is prevented. Further, the inner circumferential surfaceshape of through-hole 205 b′ of protruding part 2075 b is set to besubstantially matching with the outer circumferential surface shape ofconvex portion 2063 of positioning guide 2061. Accordingly, rotation ofpositioning guide 2061 about an axis is prevented. Accordingly,positioning guide 2061 is held by rotary table 2075 at a correctposition and in a correct manner.

Through-hole 2066 provided at positioning guide 2061 is a taperedsurface 2066 a in which a cross section in an upper region is circularand has a larger diameter as it goes upward. This upper region is aregion in which convex portion 2063 is mainly formed. An inner diameterof through-hole 2066 at an upper end of convex portion 2063 is largerthan an outer diameter of IC chip 2004, and IC chip 2004 suctioned andheld by third suction nozzle portions 2073 enters through-hole 2066 ofpositioning guide 2061 along with lowering of third suction nozzleportion 2073. The entering is guided by tapered surface 2066 a topromote a smooth downward movement.

Moreover, the inner circumferential surface in a portion of main body2062 of through-hole 2066 has a plurality of protrusions 2067 formed toprotrude toward a center. In the present embodiment, five protrusions2067 are provided. However, the number may be three for example, or anyother number may be used. A leading end position of protrusion 2067 ispositioned on an imaginary circumference which is concentric withthrough-hole 2066 and has a predetermined diameter. This predetermineddiameter may be equal to or slightly narrower than a diameter of IC chip2004. Accordingly, a circumferential edge of IC chip 2004 inserted tothrough-hole 2066 of positioning guide 2061 is supported by protrusions2067, and held in a state where a center of IC chip 2004 matches with acenter of positioning guide 2061 (through-hole 2066). Accordingly,positioning is performed with a high accuracy. Moreover, it ispreferable to manufacture positioning guide 2061 with an elastic bodysuch as rubber since it holds IC chip 2004 more firmly. Furthermore,protrusions 2067 are preferably arranged at equal intervals in thecircumferential direction. It is preferable since IC chip 2004 is evenlysupported.

Further, in the present embodiment, a push-in portion 2064 is providedon a lower surface of main body 2062. A planar shape of this push-inportion 2064 is substantially elliptical as shown in FIG. 53C. In thisexample, it has a flat collapsed shape on both ends of elliptical shapeon the long diameter side. The planar shape of this push-in portion 2064is based on a shape of a tablet to be manufactured, and is slightlysmaller than the tablet. In other words, it has a shape slightly smallerthan a cross-sectional shape of die hole 2078 formed in tablettingmachine main body 2076. Moreover, push-in portion 2064 has a taperedsurface 2064 a having a peripheral surface becoming smaller as it goesdownward. Further, in the present embodiment, protrusions 2067 formed onthe inner circumferential surface of through-hole 2066 is formed to alower end of this push-in portion 2064.

Next, a supply of IC chip 2004 from supply apparatus 2003 to IC chipsupply apparatus 2074 and a supply operation of IC chip 2004 totabletting machine will be described, and a configuration of IC chipsupply apparatus 2074 will be described. FIGS. 54A and 55A show a statewhere a leading end of third suction nozzle portion 2073 of supplyapparatus 2003 is inserted into positioning guide 2061 constituting ICchip receiving portion 2059. As shown in the drawings, second suctionand hold member 2023 moves downward, and a leading end of third nozzleportion 2073 in a state of suctioning and holding IC chip 2004 entersthrough-hole 2066 of positioning guide 2061, and stops at an appropriateposition of main body 2062. At this appropriate position, IC chip 2004is supported by protrusions 2067. Since suction by third suction nozzleportion 2073 is performed until reaching this stopped position, IC chip2004 moves downward while maintaining a horizontal state in a downwardmanner having chip main body 2006 below, and at the lower stoppingposition of third suction nozzle portion 2073, IC chip 2004 comes intocontact with a plurality of protrusions 2067 in a horizontal manner.

Next, suction by third suction nozzle portion 2073 is released, andthird suction nozzle portion 2073 moves upward and separates frompositioning guide 2061, and goes on to take next IC chip. On the otherhand, IC chip 2004 in a downward manner remaining in positioning guide2061 is supported in a state of maintaining a horizontal manner by meansof protrusions 2067 of positioning guide 2061. Further, as describedabove, a centering of IC chip 2004 is also performed with a highaccuracy.

Drawings subsequent to FIGS. 54B and 55B show a supply position totabletting machine 2002 in which rotary table 2075 is rotated by 180degrees from the state of FIGS. 54A and 55A. At this supply position,two pushes 2082 are suspended and formed at a leading end lower surfaceof an L-shaped plate 2081 moving upward and downward with a driving offirst cylinder 2080. Two pushers 2082 are in conformity with anarrangement pitch of two positioning guides 2061 adjacent to each otherin a circumferential direction, and are adjusted so that an axis centerof each positioning guide 2061 and an axis center of pusher 2082 matcheswhen the rotary table is temporarily stopped.

Further, first cylinder 2080, L-shaped plate 2081, pushers 2082, androtary table 2075 are movable upward and downward integrally. Then, theupward and downward movement is performed by receiving driving of secondcylinder 2083.

Therefore, by appropriately switching the reciprocating operation offirst cylinder 2080 and second cylinder 2083, positions of rotary table2075 and pushers 2082 can be changed. For example, FIGS. 54B and 55Bshows a state in which second cylinder 2083 allows first cylinder 2080,L-shaped plate 2081, pushers 2082, and rotary table 2075 to bepositioned at a lifted position, and first cylinder 2080 further allowspushers 2082 to be positioned at a lifted position. In this state,rotary table 2075 separates apart from an upper surface of rotatingplate 2077 of tabletting machine main body 2076, and positioning guide2061 also separates apart from an upper surface of rotating plate 2077.Moreover, a lower surface of pusher 2082 is positioned on an upper sideof positioning guide 2061, and IC chip 2004 in a downward mannersupported by pushers 2082 and positioning guide 2061 is in a non-contactstate. This state is an initial state in which rotary table 2075 isrotated to reach a supply position and temporarily stopped.

Next, only second cylinder 2083 is operated to allow first cylinder2080, L-shaped plate 2081, pushers 2082, and rotary table 2075 to bepositioned at a lowered position. Accordingly, as shown in FIGS. 54C and55C, rotary table 2075 comes close to an upper surface of rotating plate2077 of tabletting machine main body 2076, so that a lower surface ofmain body 2062 of positioning guide 2061 comes into contact with anupper surface of rotating plate 2077. Further, push-in portion 2064enters die hole 2078, and comes into contact with pharmaceutical powderfilled in die hole 2078. Moreover, at this time, since first cylinder2080 remains in the initial state, a relative positional relationshipbetween pushers 2082 and positioning guide 2061 does not change, and alower surface of pusher 2082 is positioned on an upper side ofpositioning guide 2061, and pusher 2082 and IC chip 2004 in a downwardmanner supported by positioning guide 2061 are in a non-contact state.

After that, first cylinder 2080 moves while second cylinder 2083maintaining the above-described state, and pusher 2082 moves downward.Accordingly, as shown in FIGS. 54D and 55D, a lower end of pusher 2082reaches a lower end of positioning guide 2061, in other words, a lowerend of push-in portion 2064, and IC chip 2004 is forced downward bypusher 2082 and pushed out from positioning guide 2061, and pushed intopharmaceutical powder 2090. Also during this downward movement of ICchip 2004 by pusher 2082, IC chip 2004 moves while maintaining ahorizontal state and centering by protrusions 2067 of positioning guide2061. Accordingly, when being pushed out of positioning guide 2061 andfinally pushed in and supplied to pharmaceutical powder 2090, it issupplied with a high accuracy to a center of a surface of pharmaceuticalpowder 2090 filled in die hole 2078. Moreover, since IC chip 2004 ispushed by pusher 2082 into pharmaceutical powder 2090 before beingcompressed by the tabletting machine main body, the positionaldisplacement is suppressed.

Further, since IC chip 2004 is pushed into pharmaceutical powder 2090 ina downward manner in which chip main body 2006 is positioned below, chipmain body 2006 is further inserted into pharmaceutical powder 2090 withrespect to a surface of pharmaceutical powder 2090 to which, forexample, base film 2005 comes into contact. Therefore, even when IC chip2004 attempts to move in a horizontal direction, chip main body 2006serves as a wedge, so that the positional displacement due to lateralmovement can be suppressed assuredly.

Further, in the present embodiment, as described above, the horizontalstate and centering can be maintained with a high accuracy byprotrusions 2067 of positioning guide 2061. Thus, since it can besupplied to a center of pharmaceutical powder 2090 assuredly,positioning is ensured without performing an inspection after the supplyon whether or not a supply to a correct position is performed.Accordingly, even in a case where an inspection apparatus is provided,it may be, for example, a simple sensor which confirms presence of asupply, and it can be applied to an apparatus for which a space cannotbe reserved for installation.

FIGS. 56A to 56K shows an operation of tabletting machine main body2076. As shown in FIG. 56A, in a lower side of die hole 2078, a lowerpestle 2092 is fitted from below so as to be slidable up and down. Asshown in FIG. 56I, in an upper side of die hole 2078, an upper pestle2093 is provided movably upward and downward. As shown in FIG. 56A,firstly, in a state where lower pestle 2092 is lowered within die hole2078, pharmaceutical powder 2094 is filled in die hole 2078 by means ofpharmaceutical powder filling apparatus 2094. Next, as lower pestle 2092is lifted, a supply by means of pharmaceutical powder filling apparatus2094 is cut, so that a predetermined amount of pharmaceutical powder2090 is filled in a leveled state in a space of die hole 2078 formed onan upper side of lower pestle 2092 (FIG. 56B). After that, lower pestle2092 is lowered by a predetermined quantity, so that a surface ofpharmaceutical powder 2090 is slightly lowered from an upper surface ofrotating plate 2077 (FIG. 56C).

In this state, by IC chip supply apparatus 2074 described above,positioning guide 2061 in which IC chip 2004 in a downward manner is setenters die hole 2078 (FIG. 56D), pushes out IC chip 2004 by means ofpusher 2082, and pushes it into pharmaceutical powder 2090 (FIG. 56E).

Next, rotating plate 2077 rotates so that a die hole at the supplypositions proceeds to the next step (FIG. 56F). In a state where lowerpestle 2092 is lowered within die hole 2078, pharmaceutical powder 2090is filled and supplied into die hole 2078 by means of pharmaceuticalpowder filling apparatus 2094 (FIG. 56G). Next, lower pestle 2092 islifted, and a supply by means of pharmaceutical powder filling apparatus2094 is cut, so that a predetermined amount of pharmaceutical powder2090 is filled in a leveled state in a space of die hole 2078 formed onan upper side of lower pestle 2092 (FIG. 56H).

Next, upper pestle 2093 moves downward, and pharmaceutical powder 2090is compressed between upper pestle 2093 and lower pestle 2092 (FIG.56I). Accordingly, pharmaceutical powder 2090 is solidified tomanufacture IC chip-containing tablet 2095 (FIG. 56J). After that, lowerpestle 2092 further moves upward, so that manufactured tablet 2095 isdischarged.

<Modified Example>

Push-in portion 2064 is not always necessary. Without providing push-inportion 2064, in a state where a lower surface of main body 2062 is incontact with an upper surface of rotating plate 2077, IC chip 2004 maybe pushed out with a pusher. In this case, pharmaceutical powder in thedie hole may be filled to an upper end of the die hole to be in aleveled state.

Further, when push-in portion 2064 is provided as in the above-describedembodiment, push-in portion 2064 may enter die hole 2078 to further pushin the pharmaceutical powder filled in die hole 2078. Accordingly, arecess having an inner shape in conformity with an outer shape ofpush-in portion 2064 is formed on a surface of the pharmaceuticalpowder. Accordingly, since IC chip 2004 is set within the recess, thepositional displacement due to the lateral movement can be suppressedassuredly.

Moreover, even in the case where push-in portion 2064 is provided,push-in portion 2064 may be set so as not to come into contact withpharmaceutical powder. For example, depending on a material ofpharmaceutical powder, pharmaceutical powder may be attached to asurface of push-in portion 2064 by contact, or pharmaceutical powder maybe dispersed to a periphery at the time of contact. In such a case,providing push-in portion 2064 at a position not in contact withpharmaceutical powder may avoid the problem.

Moreover, in the above-described embodiment, IC chip 2004 is pushed intopharmaceutical powder 2090. However, the present invention is notlimited to this. For example, IC chip 2004 may remain on the surface ofpharmaceutical powder 2090 by a dropping supply. For example, when ICchip 2004 is pushed into pharmaceutical powder 2090, the force ofpushing-in may cause pharmaceutical powder 2090 to fly, so that it mayaffect the detection of presence of an IC chip in the subsequent step.By not pushing in the IC chip, the influence can be suppressed as soonas possible. Moreover, when the dropping supply is performed, it isfavorable that the falling distance is small.

Even in the case of providing protrusions, positioning guide 2061 may beomitted at the lower end rather than forming it to the lower end. Insuch a case, for example, protrusions may be formed only at the mainbody portion, and the protrusions may be omitted entirely or partiallyat the portion corresponding to the push-in portion.

It should be noted that, in the above-described embodiment, positioningguide 2061 including at its inner circumferential surface protrusions2067 is provided, and it is pushed by a pusher in a state where IC chip2004 is set within positioning guide 2061. However, the presentinvention is not limited to this. For example, suction means may be usedin place of the pusher, and the IC chip suctioned by suction means maybe pushed into the pharmaceutical powder within the die hole to supplythe same.

Furthermore, in the above-described embodiment, a lower end ofpositioning guide 2061 (push-in portion 2064) enters die hole 2078 byupward and downward movement. However, positioning guide 2061 and rotarytable 2075 may be not moved upward and downward. By omitting the step ofmoving upward and downward, a cycle time is shortened, and the processcan be speeded up. In this case, IC chip 2004 is supplied by dropping itinto die hole 2078.

Moreover, in the above-described embodiment, the IC chip is suppliedinto pharmaceutical powder in a downward manner. However, it may besupplied in an upward manner.

The tablet manufacturing apparatus is (1) a tablet manufacturingapparatus, which manufactures an IC chip-containing tablet by supplyingan IC chip on pharmaceutical powder filled in a die hole, furtherfilling pharmaceutical powder onto the IC chip, and compressing thesepharmaceutical powder and the IC chip from above and below, and itincludes supply means which performs a supply of the IC chip by pushingin the IC chip into pharmaceutical powder in a state where the IC chipis positioned above pharmaceutical powder within a die hole before beingcompressed.

Since the IC chip is supplied by pushing into pharmaceutical powderbefore being compressed, it can be supplied to a desired position with ahigh accuracy, so that the positional displacement can be suppressed.

(2) The IC chip includes a convex portion on one surface, and it isfavorable to supply the IC chip by pushing the convex portion intopharmaceutical powder in a downward manner with the convex portionprovided on a lower side. The convex portion corresponds to chip mainbody 6 in the embodiment. It is not limited to attach chip main body 6to base film 6 as in the embodiment. For example, it can be applied tovarious forms such as having a convex portion on a surface of the chipmain body of the embodiment. According to the present invention, theconvex portion is further inserted into pharmaceutical powder.Accordingly, for example, the convex portion serves as a wedge even whenthe IC chip attempts to move in the horizontal direction, and thepositional displacement due to the lateral movement can be suppressedassuredly.

(3) The IC chip is set in the accommodation portion provided on acarrier tape in an upward manner with the convex portion on an upperside, and is accommodated in an accommodation tape having an openingside of the accommodation portion covered with a top tape, and it may beconfigured such that the IC chip in an upward manner is taken out fromthe accommodation portion, and the taken out IC chip may be reversedupside down to be in a downward manner, and may be supplied by supplymeans. Accordingly, even with the one supplied in an upward manner, itcan be converted into a downward manner and supplied to thepharmaceutical powder.

(4) The supply means may include a position guide holding an IC chipwithin a through-hole penetrating up and down, and pushing means whichis arranged on an upper side of the positioning guide and pushes out theIC chip downward.

Since the IC chip is pushed in and supplied to pharmaceutical powderbefore being compressed, it can be supplied to a desired position with ahigh accuracy, so that the positional displacement can be suppressed.

An manner position converting apparatus is (1) an manner convertingapparatus which changes an manner of an electronic part by passing anelectronic part suctioned and held by a first suction and hold member toa second suction and hold member suctioning the same, and it isconfigured to perform the passing in a state where a suction portion ofthe first suction and hold member and a suction portion of the secondsuction and hold member are inserted into through-holes of a guidemember having the through-holes at both ends. The electronic partcorresponds to the IC chip of the embodiment. In the embodiment, the ICchip is provided in a tablet. However, the present invention can beapplied not only to this but also to various electronic parts. Moreover,the through-holes of the present invention are opened at both ends, andthe first suction and hold member and second suction and hold memberenter into the through-holes respectively through the openings on bothends. However, for example, a part of the side surface of thethrough-hole may be opened by a slit or other structure. It should benoted that the manner converting apparatus may be used for anyapplication other than the tablet manufacturing apparatus.

Since the passing of electronic parts between the suction and holdmembers is performed within the guide members (through-holes), thepassing can be performed assuredly without any influence from outside orperipheral atmosphere.

(2) The cylindrical guide is may be configured so that inner shapedimensions of the through-hole is formed to be wide at both ends andnarrow at an intermediate position, and passing is performed at theintermediate position. In such a manner, since the both ends are wide,both suction and hold members can smoothly enter at the leading end intothe cylindrical guide, and the passing is performed at the narrow space,it is preferable. The narrow space at the intermediate position may beformed to have an inner shape dimension shape corresponding to the outerdimension shape of the electronic part. The corresponding inner shapedimensions shape may be set equal to or larger than the outer dimensionshape.

(3) The electronic part is accommodated in an accommodation tape, andthe first suction and hold member may be configured to suction and holdthe electronic part within the accommodation tape, rotate it by a setangle, and insert the electronic part into a guide member. (4) The setangle may be 180 degrees. It is favorable since a reverse apparatus forreversing an electronic part upside down can be configured in a simplemanner.

(5) It is favorable that the guide member is constituted of a fixedcylindrical guide. This cylindrical guide is achieved in the embodiment.It is favorable since it can be achieved with a simple configuration.(6) The guide member includes a plurality of moving guide members and adrive mechanism for allowing the moving guide members to come close toand separate from each other, and it is favorable to form through-holesby allowing the plurality of moving guide members to come close to eachother. In this manner, by separating the moving guide members, a spacewider than the through-hole is reserved, and for example, even in a casewhere a positional displacement occurs at the time of suctioning andholding an electronic part by means of the first suction and holdmember, when the moving guide members are moved to come close to eachother in the state where the first suction and hold member is positionedat the passing position of the electronic part to the second suction andhold member, a leading end of the moving guide members come into contactwith a side surface of the electronic part to move to a center andposition the same, so that it is favorable.

Accordingly, passing of the electronic part can be performed assuredly.To solve the problem described above, an IC chip supply apparatus of thepresent invention is (1) an IC supply apparatus in a tabletmanufacturing apparatus for manufacturing IC chip-containing tablets bysupplying an IC chip onto pharmaceutical powder filled in a die hole,further filling pharmaceutical powder onto the IC chip, and compressingthese pharmaceutical powder and the IC chip from above and below, and itincludes a positioning guide holding the IC chip within a through-holepenetrating up and down, and pushing-out means arranged on an upper sideof the positioning guide and pushing out the IC chip downward, and aplurality of protrusions protruding toward a center is included insideof the through-hole, and the IC chip is held by the protrusions. Thepushing-out means corresponds to pusher 2082 in the embodiment.

According to the present invention, by the protrusions of thepositioning guide, the IC chip is set and held with a high accuracy at adesired position in a cross section within the through-hole. Thus, theIC chip can be supplied at a desired position within a die holecorresponding to the set position. Accordingly, for example, it can beassuredly supplied to a center of pharmaceutical powder, positioning canbe secured without performing an inspection on whether or not a supplyis performed to a correct position after the supplying operation.Accordingly, for example, even in the case where the inspectionapparatus is provided, it may be a simple sensor which confirms presenceof a supply, and an apparatus which cannot reserve a space forinstallation can be used.

(2) The plurality of protrusion may be convex threads extending along anaxial direction of the through-hole. (3) The convex threads may beformed to a lower end of the through-hole. In such a manner, thepositioning can be performed until immediately before pushing out from alower end of the positioning guide, thus it is preferable.

(4) The positioning guide may be provided with a push-in portionprotruding downward at a lower surface, and the push-in portion mayenter the die hole. In such a manner, since the push-in portion entersthe die hole, the IC chip can be supplied to a desired position withinthe die hole.

(5) The positioning guide may be provided at a rotation member, and mayhave a function of holding with the protrusions the IC chip by insertingthe IC chip from above with respect to the positioning guide located atthe receiving position, and the positioning guide holding the IC chipmay rotate with the rotation of the rotation member and positioned on anupper side of the die hole of the tabletting machine, and the IC chipheld by the pushing-out means may allow an IC chip to be supplied into adie hole. The passing of the IC chip from an apparatus on an upstreamside, and a supply of an IC chip to a tabletting machine can beperformed simultaneously, so that the productivity is improved.

(6) A tablet manufacturing apparatus of the present invention mayinclude means for filling pharmaceutical powder into a die hole, the ICchip supply apparatus according to any one of (1) to (5) supplying an ICchip onto the pharmaceutical powder, means for filling pharmaceuticalpowder from above the supplied IC chip, and means for manufacturing anIC chip-containing tablet by compressing these pharmaceutical powder andthe IC chip from above and below.

By the plurality of protrusions provided at the positioning guide, theIC chip is held at a desired position, and supplied into the die hole inthat state, so that it can be supplied to a desired position with a highaccuracy, and the positional displacement can be suppressed.

A manufacturing apparatus for medical tablets is a manufacturingapparatus for medical tablets, which manufactures an IC chipmember-containing tablet 95, 1095, 2095 by supplying an IC chip 4, 1004,2004 as an IC chip member equipped with an IC on pharmaceutical powderfilled in a die hole, thereafter filling pharmaceutical powder onto ICchip 4, 1004, 2004, and compressing these pharmaceutical powder and ICchip 4, 1004, 2004 from above and below, and IC chip 4, 1004, 2004 has abase film 5, 1005, 2005 as a base plane, and a chip main body 6, 1006,2006 as a convex portion protruding more on one side than the other sidewith respect to base film 5, 1005, 2005, and the manufacturing apparatusfor medical tablets includes a supply apparatus 3, 1003, 2003 whichholds IC chip 4, 1004, 2004 in a downward manner with chip main body 6,1006, 2006 facing downward, and supplies IC chip 4, 1004, 2004 on thepharmaceutical powder.

IC chip 4, 1004, 2004 is set in an accommodation recess 8 a, 1008 a,2008 a as an accommodation portion provided in a carrier tape 8, 1008,2008 in an upward manner with chip main body 6, 1006, 2006 facingupward, and is accommodated in an accommodation tape 7, 1007, 2007 inwhich an opening side of accommodation recess 8 a, 1008 a, 2008 a iscovered with a top tape 9, 1009, 2009, and IC chip 4, 1004, 2004 in anupward manner is taken out of accommodation recess 8 a, 1008 a, 2008 a,and taken-out IC chip 4, 1004, 2004 is reversed upside down and changedto the downward manner, and there after supply apparatus 3, 1003, 2003supplies IC chip 4, 1004, 2004.

A first suction and hold member 22, 1022, 2022 which suctions and holdsIC chip 4, 1004, 2004, a second suction and hold member 23, 1023, 2023which suctions IC chip 4, 1004, 2004 held by first suction and holdmember 22, 1022, 2022, from a side opposite to first suction and holdmember 22, 1022, 2022, and a cylindrical guide 40, 1040, 2040 as a guidemember provided with a through-hole 41, 1041, 2041 into which IC chip 4,1004, 2004 is inserted, a suction portion of first suction and holdmember 22, 1022, 2022 is inserted from one side of through-hole 41,1041, 2041, and a suction portion of second suction and hold member 23,1023, 2023 is inserted from the other side of through-hole 41, 1041,2041, and IC chip 4, 1004, 2004 is passed from first suction and holdmember 22, 1022, 2022 to second suction and hold member 23, 1023, 2023within through-hole 41, 1041, 2041.

Inner shape dimensions of through-hole 41, 1041, 2041 are formed to bewide at end portions in inlet region 41 a, 1041 a, 2041 a and outletregion 41 c, 1041 c, 2041 c, and to be narrow at a center region 41 b,1041 b, 2014 b as an intermediate position (intermediate region), and ICchip 4, 1004, 2004 is passed at center region 41 b, 1041 b, 2041 b.

IC chip 4, 1004, 2004 is accommodated in a carrier tape 8, 1008, 2008,and first suction and hold member 22, 1022, 2022 suctions and holds ICchip 4, 1004, 2004 within carrier tape 8, 1008, 2008, rotates by a setangle, and inserts IC chip 4, 1004, 2004 into through-hole 41, 1041,2041 in cylindrical guide 40, 1040, 2040. Guide member 1098 includes aplurality of moving guide members 1096, and a cylinder 1097 as a drivemechanism which causes the plurality of moving guide members 1096 tocome close to or separate from each other, and the plurality of movingguide members 1096 come close to form the through-hole.

A manufacturing apparatus for medical tablets is a manufacturingapparatus for medical tablets, which manufactures an IC chip 4, 1004,2004-containing tablet 95, 1095, 2095 by supplying an IC chip 4, 1004,2004 on pharmaceutical powder filled in a die hole, further fillingpharmaceutical powder onto IC chip 4, 1004, 2004, and compressing thesepharmaceutical powder and IC chip 4, 1004, 2004 from above and below,and it includes a positioning guide 61, 1061, 2061 which has athrough-hole 66, 1066, 2066 penetrating up and down, and holds IC chip4, 1004, 2004 within through-hole 66, 1066, 2066, and a pusher 82, 1082,2082 as a push-out portion arranged above positioning guide 61, 1061,2061 for pushing out IC chip 4, 1004, 2004 downward, and a plurality ofprotrusions 67, 1067, 2067 protruding toward a center are provided on aninside of through-hole 66, 1066, 2066, and IC chip 4, 1004, 2004 is heldby protrusions 67, 1067, 2067.

The plurality of protrusions 67, 1067, 2067 are convex threads extendingalong an axial direction of the through-hole. The convex threads areformed to a lower end of through-hole 66, 1066, 2066.

Positioning guide 61, 1061, 2061 is provided to a rotary table 75, 1075,2075 as a rotation member, and IC chip 4, 1004, 2004 is pushed fromabove into positioning guide 61, 1061, 2061 at a receiving position andIC chip 4, 1004, 2004 is held by protrusions 67, 1067, 2067, and, in astate where positioning guide 61, 1061, 2061 holding IC chip 4, 1004,2004 rotates and moves together with rotation of rotary table 75, 1075,2075 and is located above the die hole of a tabletting machine, hold ICchip 4, 1004, 2004 is supplied into the die by pusher 82, 1082, 2082.

A manufacturing method for medical tablets includes the steps of holdingan IC chip 4, 1004, 2004, which has a base film 5, 1005, 2005 and a chipmain body 6, 1006, 2006 protruding more on one side than on the otherside with respect to base film 5, 1005, 2005, in a downward manner withthe convex portion facing downward, and supplying the IC chip in thedownward manner on pharmaceutical powder, and manufacturing a tablet 95,1095, 2095 containing IC chip 4, 1004, 2004 by filling pharmaceuticalpowder onto IC chip 4, 1004, 2004, and compressing these pharmaceuticalpowder and IC chip 4, 1004, 2004 from above and below.

A manufacturing method for medical tablet includes the steps of a firstsuction and hold member 22, 1022, 2022 suctioning and holding an IC chip4, 1004, 2004, inserting a suction portion of first suction and holdmember 22, 1022, 2022 from one side of a through-hole 41, 1041, 2041,inserting a suction portion of second suction and hold member 23, 1023,2023 from the other side of through-hole 41, 1041, 2041, passing IC chip4, 1004, 2004 from first suction and hold member 22, 1022, 2022 tosecond suction and hold member 23, 1023, 2023 within through-hole 41,1041, 2041 to hold IC chip 4, 1004, 2004 in a downward manner.

A manufacturing method for medical tablets includes the steps of holdingan IC chip 4, 1004, 2004 with a plurality of protrusions 67, 1067, 2067protruding toward a center provided on an inside of a through-hole 66,1066, 2066 in a positioning guide 61, 1061, 2061, supplying IC chip 4,1004, 2004 held within through-hole 66, 1066, 2066 on pharmaceuticalpowder filled in a die hole, and manufacturing a tablet 95, 1095, 2095containing IC chip 4, 1004, 2004 by filling pharmaceutical powder ontoIC chip 4, 1004, 2004, and compressing these pharmaceutical powder andIC chip 4, 1004, 2004 from above and below.

The manufacturing method further includes the step of pushing IC chip 4,1004, 2004 from above into positioning guide 61, 1061, 2061 located at areceiving position, and the step of supplying IC chip 4, 1004, 2004includes supplying IC chip 4, 1004, 2004 into the die hole by a push-outportion, in a state where positioning guide 61, 1061, 2061 holding ICchip 4, 1004, 2004 rotates and moves together with rotation of rotarytable 75, 1075, 2075 and is located above the die hole of a tablettingmachine.

REFERENCE SIGNS LIST

2, 1002, 2002 tabletting machine; 3, 1003, 2003 supply apparatus; 4,1004, 2004 IC chip; 5, 1005, 2005 base film; 6, 1006, 2006 chip mainbody; 13, 1013, 2013 accommodation tape opening portion; 20, 1020, 2020IC chip take-out apparatus; 21, 1021, 2021 conveying apparatus; 22,1022, 2022 first suction and hold member; 23, 1023, 2023 second suctionand hold member; 40, 1040, 2040 cylindrical guide; 61, 1061, 2061positioning guide; 1096 moving guide member; 1098 guide member; 2074 ICchip supply apparatus.

1. An apparatus, comprising: a medical tablet including an integratedcircuit (IC) chip member equipped with an IC therein, said medicaltablet having a first surface and a second surface opposite the firstsurface, wherein an engraved stamp or cleavage line is formed in saidfirst surface, an engraved stamp or cleavage line is not formed or anengraved stamp or cleavage line shallower than that in said firstsurface is formed in said second surface, and said IC chip member has abase plane and a convex portion protruding more on one side than on theother side with respect to said base plane, and the convex portion isarranged within the medical tablet to face the second surface.
 2. Theapparatus of claim 1, wherein the engraved stamp or cleavage line formedin said first surface is formed in an upper pestle of a tabletingmachine.
 3. The apparatus of claim 1, wherein the IC chip member isconfigured to be supplied on pharmaceutical powder in a die hole by asupply portion, the IC chip member is configured to be held in adownward manner by the supply portion such that the convex portion facesdownward when said supply portion supplies the IC chip member on thepharmaceutical powder.
 4. The apparatus of claim 1, wherein the IC chipmember is configured to be held by a carrier tape having anaccommodation portion in an upward manner where the convex portion facesupward, the IC chip member in the upward manner is configured to beremoved from the accommodation portion, reversed upside down and changedto said downward manner, prior to being supplied onto pharmaceuticalpowder.
 5. The apparatus of claim 1, wherein the medical tablet includesfirst pharmaceutical powder and second pharmaceutical powder, the ICchip member is configured to be supplied onto the first pharmaceuticalpowder in a downward manner such that the convex portion faces downwardand contacts the first pharmaceutical powder prior to the secondpharmaceutical powder being supplied onto the IC chip member.
 6. Theapparatus of claim 1, wherein the IC chip member is configured to becompressed between first pharmaceutical powder and second pharmaceuticalpowder by a set of pestles.
 7. The apparatus of claim 1, wherein the ICchip member is configured to be held within a through-hole defined by apositioning guide and having a plurality of protrusions protrudingtoward a center of the through-hole to hold the IC chip member in adownward manner where the convex portion faces downward, the IC chipmember configured to be pushed out of the positioning guide and ontofirst pharmaceutical powder filled in a die hold such that secondpharmaceutical powder can be filled onto the IC chip member to definethe medical tablet.